Mechanistic models for additive manufacturing of metallic components

被引:394
作者
Wei, H. L. [1 ]
Mukherjee, T. [2 ]
Zhang, W. [3 ]
Zuback, J. S. [2 ]
Knapp, G. L. [2 ]
De, A. [4 ]
DebRoy, T. [2 ]
机构
[1] Nanjing Univ Sci & Technol, Sch Mech Engn, Nanjing, Peoples R China
[2] Penn State Univ, Dept Mat Sci & Engn, University Pk, PA 16802 USA
[3] Ohio State Univ, Dept Mat Sci & Engn, 116 W 19Th Ave, Columbus, OH 43210 USA
[4] Indian Inst Technol, Dept Mech Engn, Mumbai, Maharashtra, India
关键词
Additive manufacturing; 3D printing; Modeling; Heat transfer and fluid flow; Microstructure; Defects; POWDER-BED FUSION; CONVECTIVE HEAT-TRANSFER; DUCTILITY-DIP CRACKING; ALLOYING ELEMENT VAPORIZATION; FUNCTIONALLY GRADED MATERIAL; 316L STAINLESS-STEEL; MELT POOL DYNAMICS; HIGH-TEMPERATURE BEHAVIOR; GRAIN-STRUCTURE EVOLUTION; DIRECT LASER DEPOSITION;
D O I
10.1016/j.pmatsci.2020.100703
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Additive manufacturing (AM), also known as 3D printing, is gaining wide acceptance in diverse industries for the manufacturing of metallic components. The microstructure and properties of the components vary widely depending on printing process and process parameters, and prediction of causative variables that affect structure, properties and defects is helpful for their control. Since models are most useful when they can correctly predict experimental observations, we focus on the available mechanistic models of AM that have been adequately validated. Specifically, the applications of transport phenomena models in the studies of solidification, residual stresses, distortion, formation of defects and the evolution of microstructure and properties are critically reviewed. The functionality of AM models in understanding of the printability of commonly used AM alloys and the fabrication of functionally graded alloys are also assessed. Opportunities for future research are identified considering the gaps in knowledge in modeling. The uniqueness of this review includes substantive discussions of the rapid certification of the AM components aided by scale models, bidirectional models, cloud based big data, machine learning and digital twins of AM hardware.
引用
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页数:113
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