A new method for reliable determination of strain-rate sensitivity of low-dimensional metallic materials by using nanoindentation

被引:39
作者
Liu, Y. [1 ]
Hay, J. [2 ]
Wang, H. [1 ,3 ]
Zhang, X. [1 ,4 ]
机构
[1] Texas A&M Univ, Dept Mat Sci & Engn, College Stn, TX 77843 USA
[2] Agilent Technol, Nanoscale Sci Div, Oak Ridge, TN 37830 USA
[3] Texas A&M Univ, Dept Elect Engn, College Stn, TX 77843 USA
[4] Texas A&M Univ, Dept Mech Engn, College Stn, TX 77843 USA
关键词
Nanoindentation; Thermal drift; Strain-rate sensitivity (SRS); Thin film; Creep; MECHANICAL-PROPERTIES; DEFORMATION KINETICS; ACTIVATION VOLUME; ULTRAFINE GRAIN; ELASTIC-MODULUS; NANOCRYSTALLINE; TEMPERATURE; DUCTILITY; BEHAVIOR; NI;
D O I
10.1016/j.scriptamat.2013.12.022
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Nanoindentation is increasingly used to determine the strain-rate sensitivity of nanocrystalline metallic thin films. However, traditional data analysis yields large uncertainty on displacements measured at low strain rates due to thermal drift. Here we use a new method that renders hardness insensitive to thermal drift. The method involves directly measuring contact stiffness and calculating the contact area from the measured stiffness and modulus. The new technique is validated through nanocrystalline Ni and nanotwinned Cu films and returns expected values. Published by Elsevier Ltd. on behalf of Acta Materialia Inc.
引用
收藏
页码:5 / 8
页数:4
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