Microstructure and mechanical properties of partial transient liquid phase bonded Si3N4-DZ483 superalloy joints

被引：17

作者：

Lan, Liang ^{[1
]}

Ren, Zhongming ^{[1
]}

Yu, Jianbo ^{[1
]}

Yang, Zhigang ^{[1
]}

Zhong, Yunbo ^{[1
]}

机构：

[1] Shanghai Univ, Key Lab Adv Met & Proc Mat, Shanghai 200072, Peoples R China

来源：

MATERIALS LETTERS | 2014年 / 121卷

关键词：

Si3N4; ceramics; Nickel-based superalloy; Interfaces; Microstructure; Joint strength; HIGH-TEMPERATURE APPLICATIONS; SILICON-NITRIDE; FOIL INTERLAYER; METAL JOINTS; SI3N4; CERAMICS; NICKEL;

D O I：

10.1016/j.matlet.2014.01.072

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Partial transient liquid phase bonding (PTLPB) was applied to silicon nitride/nickel-based superalloy (DZ483) joints using Ti/Cu/Ni interlayers. Microstructure examination and mechanical properties evaluation of the joints show that bonding of Si3N4 to superalloy was successful. A uniform compact reaction layer about 2.7 mu m thickness was found at the Si3N4/Ti interface, which was formed by the reaction between Ti and Si3N4 substrate. With joining temperature rising, the flexural strength of the joining samples increased initially and then decreased. When the joining temperature was 1323 K, the flexural strength of the joints reached to 170 MPa. The fracture behavior of the joints was also discussed, with the ceramic reaction layer being the region where all failures occurred. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：223 / 226

页数：4

共 18 条

[1] PTLPB of Si3N4 to FA-129 using nickel as a core interlayer [J].

Brochu, M ;

Pugh, MD ;

Drew, RAL .

INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, 2004, 22 (2-3) :95-103

[2] An evaluation of the partial, transient liquid phase bonding of Si3N4 using Au coated Ni-22Cr foils [J].

Ceccone, G ;

Nicholas, MG ;

Peteves, SD ;

Tomsia, AP ;

Dalgleish, BJ ;

Glaeser, AM .

ACTA MATERIALIA, 1996, 44 (02) :657-667

[3] Overview of transient liquid phase and partial transient liquid phase bonding [J].

Cook, Grant O., III ;

Sorensen, Carl D. .

JOURNAL OF MATERIALS SCIENCE, 2011, 46 (16) :5305-5323

[4] Bonding of silicon nitride ceramics using Fe-Ni/Cu/Ni/Cu/Fe-Ni interlayers [J].

Fang, F ;

Zheng, C ;

Lou, HQ ;

Sui, RZ .

MATERIALS LETTERS, 2001, 47 (03) :178-181

[5] Study of SiC-nickel alloy bonding for high temperature applications [J].

Hattali, M. L. ;

Valette, S. ;

Ropital, F. ;

Stremsdoerfer, G. ;

Mesrati, N. ;

Treheux, D. .

JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2009, 29 (04) :813-819

[6]

Jiasheng Z, 2003, WELD J, V32, P8

[7] Interfacial microstructure of partial transient liquid phase bonded Si3N4-to-Inconel 718 joints [J].

Kim, JJ ;

Park, JW ;

Eagar, TW .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2003, 344 (1-2) :240-244

[8] Silicon Nitride for High-Temperature Applications [J].

Klemm, Hagen .

JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2010, 93 (06) :1501-1522

[9] Joining of silicon nitride with a titanium foil interlayer [J].

Lemus, J ;

Drew, RAL .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2003, 352 (1-2) :169-178

[10] Mechanical properties of silicon nitride joints using a Ti-foil interlayer [J].

Lemus-Ruiz, J ;

Aguilar-Reyes, EA .

MATERIALS LETTERS, 2004, 58 (19) :2340-2344

← 1 2 →