An Effective Gray-Box Identification Procedure for Multicore Thermal Modeling

被引:41
作者
Beneventi, Francesco [1 ]
Bartolini, Andrea [1 ]
Tilli, Andrea [1 ]
Benini, Luca [1 ]
机构
[1] Univ Bologna, Dept Elect Comp Sci & Syst, I-40136 Bologna, Italy
关键词
Thermal control; thermal model; multicore; power model; gray box; system identification;
D O I
10.1109/TC.2012.293
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Aggressive thermal management is a critical feature for high-end computing platforms, as worst-case thermal budgeting is becoming unaffordable. Reactive thermal management, which sets temperature thresholds to trigger thermal capping actions, is too "near-sighted," and it may lead to severe performance degradation and thermal overshoots. More aggressive proactive thermal managements minimize performance penalty with smooth optimal control. These techniques require knowledge of thermal models, which have to be accurate and simple to make the controls effective, while keeping their complexity limited. In practice, these models are not provided by manufacturers, and in most cases, they strongly depend on the deployment environment. Hence, procedures to automatically derive thermal models in the field are needed. In this paper, we propose a gray-box procedure to learn a compact and physically consistent model for multicore chips. We leverage the physical consistency of the proposed model to tame the model complexity and to face large quantization noise in measurements. We exploit Output Error structures along with Levenberg-Marquardt and Least Squares optimization algorithms. We tackle the problem in a real-life contest: we developed a complete infrastructure for model building and thermal data collection in the Linux environment, and we tested it on an Intel Nehalem-based server CPU.
引用
收藏
页码:1097 / 1110
页数:14
相关论文
共 51 条
[31]   Parameterized Architecture-Level Dynamic Thermal Models for Multicore Microprocessors [J].
Li, Duo ;
Tan, Sheldon X. -D. ;
Pacheco, Eduardo H. ;
Tirumala, Murli .
ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS, 2010, 15 (02)
[32]   Architecture-Level Thermal Characterization for Multicore Microprocessors [J].
Li, Duo ;
Tan, Sheldon X. -D. ;
Pacheco, Eduardo Hernandez ;
Tirumala, Murli .
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2009, 17 (10) :1495-1507
[33]  
Lourakis M., 2004, LEVMAR LEVENBERG MAR
[34]   Cooling a microprocessor chip [J].
Mahajan, Ravi ;
Chiu, Chia-Pin ;
Chrysler, Greg .
PROCEEDINGS OF THE IEEE, 2006, 94 (08) :1476-1486
[35]  
*MATH WORKS INC, MATLAB SIM
[36]  
Ranieri J, 2012, DES AUT CON, P636
[37]   Improved Thermal Tracking for Processors Using Hard and Soft Sensor Allocation Techniques [J].
Reda, Sherief ;
Cochran, Ryan J. ;
Nowroz, Abdullah Nazma .
IEEE TRANSACTIONS ON COMPUTERS, 2011, 60 (06) :841-851
[38]  
SCARAMELLA J, 2006, 203598 IDC
[39]   Accurate Direct and Indirect On-Chip Temperature Sensing for Efficient Dynamic Thermal Management [J].
Sharifi, Shervin ;
Rosing, Tajana Simunic .
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2010, 29 (10) :1586-1599
[40]  
Skadron K, 2002, EIGHTH INTERNATIONAL SYMPOSIUM ON HIGH-PERFORMANCE COMPUTER ARCHITECTURE, PROCEEDINGS, P17