Implementation of an LTCC Quad-band Module for WLAN and WIMAX Applications

被引:0
作者
Kim, Dong Ho [1 ,2 ]
Kim, Dongsu [1 ]
Ryu, Jong In [1 ]
Kim, Jun Chul [1 ]
Park, Chong Dae [2 ]
Song, In Sang [3 ]
机构
[1] Korea Elect Technol Inst, Elect Mat & Packaging Res Ctr, 68 Yatap Dong, Songnam 463816, Gyeonggi Do, South Korea
[2] Myongji Univ, Elect Engn, Seoul 449728, South Korea
[3] Samsung Adv Inst Technol, Seoul 449712, South Korea
来源
2008 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3 | 2008年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, a compact quad-band module for Wireless Local Area Network (WLAN) and Worldwide Interoperability for Microwave Access (WiMAX) applications is realized by Low Temperature Co-fired Ceramic (LTCC) technology. The quad-band module is composed of four bandpass filters, and matching networks, which are fully embedded in the LTCC substrate, and two MMIC switches are attached on the substrate via bond wires. The fabricated quad-band module has 11 layers and it occupies less than 6.0 mm x 4.0 mm x 0.528 mm. In case of WLAN-band operation, the measured insertion losses are less than 3.8 dB in both 2 GHz and 5 GHz bands. In case of WiMAX-band operation, the insertion losses are less than 3.8 dB in both 3 GHz and 5 GHz bands. A return loss and rejection characteristics are good at all bands. The measured results of the implemented quad-band module are in pretty good argeement with the simulated results.
引用
收藏
页码:1456 / +
页数:2
相关论文
共 5 条
  • [1] KIM DS, 2006, 36 EUR MICR C, V1
  • [2] KIM JC, IT SOC C 2005
  • [3] Design of an LTCC switch diplexer front-end module for GSM/DCS/PCS applications
    Lucero, R
    Qutteneh, W
    Pavio, A
    Meyers, D
    Estes, J
    [J]. 2001 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS, 2001, : 213 - 216
  • [4] Novel high-rejection LTCC diplexers for dual-band WLAN applications
    Orlenko, D
    Markov, K
    Royak, S
    Gordiyenko, A
    Chernyakov, O
    Kerssenbrock, T
    Sevskiy, G
    Heide, P
    [J]. 2005 IEEE MTT-S International Microwave Symposium, Vols 1-4, 2005, : 727 - 730
  • [5] Orlenko D, 2005, 35TH EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGS, P97