Dynamic DSC characterization of epoxy resin by means of the Avrami equation

被引:42
作者
Lu, MG
Shim, MJ
Kim, SW
机构
[1] Univ Seoul, Dept Chem Engn, Seoul 130743, South Korea
[2] Univ Seoul, Dept Life Sci, Seoul 130743, South Korea
来源
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY | 1999年 / 58卷 / 03期
关键词
Avrami expression; CTBN; cure kinetics; epoxy;
D O I
10.1023/A:1010177116739
中图分类号
O414.1 [热力学];
学科分类号
摘要
A phenomenological approach was used to characterize the cure processes of epoxy resins (a diglycidyl ether of bisphenol A and its modifier CTBN) from dynamic experiments by DSC. Various kinetic parameters were obtained by using a modified Avrami expression. The resulting overall activation energies for the two systems agreed very well with the published data in the whole cure temperature range. In contrast with the isothermal results and the general dynamic models, a change in the exponent and the non-linear temperature dependence of the rate constant were also observed.
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页码:701 / 709
页数:9
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