Brief Review of Surface Passivation on III-V Semiconductor

被引:86
作者
Zhou, Lu [1 ]
Bo, Baoxue [2 ]
Yan, Xingzhen [1 ]
Wang, Chao [1 ]
Chi, Yaodan [1 ]
Yang, Xiaotian [1 ]
机构
[1] Jilin Jianzhu Univ, Sch Elect Engn & Comp, Jilin Prov Key Lab Architectural Elect & Comprehe, Changchun 130118, Jilin, Peoples R China
[2] Changchun Univ Sci & Technol, Natl Key Lab High Power Semicond Lasers, Changchun 130022, Peoples R China
基金
中国国家自然科学基金;
关键词
III-V semiconductor; passivation; MOCAP; ALD; XPS; SELF-ASSEMBLED MONOLAYERS; ATOMIC-LAYER-DEPOSITION; GAAS SURFACE; ELECTRICAL-PROPERTIES; THERMAL-STABILITY; INTERFACE QUALITY; FILMS; ALKANETHIOL; GROWTH; AL2O3;
D O I
10.3390/cryst8050226
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
The III-V compound semiconductor, which has the advantage of wide bandgap and high electron mobility, has attracted increasing interest in the optoelectronics and microelectronics field. The poor electronic properties of III-V semiconductor surfaces resulting from a high density of surface/interface states limit III-V device technology development. Various techniques have been applied to improve the surface and interface quality, which cover sulfur-passivation, plasmas-passivation, ultrathin film deposition, and so on. In this paper, recent research of the surface passivation on III-V semiconductors was reviewed and compared. It was shown that several passivation methods can lead to a perfectly clean surface, but only a few methods can be considered for actual device integration due to their effectiveness and simplicity.
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页数:14
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