Effect of thermal annealing on charge exchange between oxygen interstitial defects within HfO2 and oxygen-deficient silicon centers within the SiO2/Si interface

被引:14
|
作者
Lauer, J. L. [1 ,2 ]
Shohet, J. L. [1 ,2 ]
Nishi, Y. [3 ]
机构
[1] Univ Wisconsin Madison, Dept Elect & Comp Engn, Madison, WI 53706 USA
[2] Univ Wisconsin Madison, Plasma Proc & Technol Lab, Madison, WI 53706 USA
[3] Stanford Univ, Stanford, CA 94305 USA
关键词
charge exchange; hafnium compounds; high-k dielectric thin films; interstitials; rapid thermal annealing; semiconductor-insulator boundaries; silicon; silicon compounds; surface potential; ultraviolet radiation effects; ultraviolet spectra; VACUUM-ULTRAVIOLET SPECTRA; ABSOLUTE INTENSITIES; RADIATION-DAMAGE; GATE STACKS; OXIDE; LAYER; EMISSION;
D O I
10.1063/1.3122925
中图分类号
O59 [应用物理学];
学科分类号
摘要
We compare the charging response of rapid thermally annealed (800 and 1000 degrees C) 4 nm thick HfO2 to as-deposited HfO2 on Si by measuring the surface potential of the HfO2 layers after vacuum ultraviolet (VUV) irradiation with 11.6 eV photons. From VUV spectroscopy, we determined all HfO2 layers show the presence of oxygen-interstitial defects (OIDs). The electronic states of OID in HfO2 line up in energy with oxygen-deficient Si centers within the SiO2 interfacial layer. This implies charge exchange between OIDs within HfO2 and the O-deficient silicon centers within the SiO2 interfacial layer are very important for controlling the radiation-induced trapped charge in HfO2 dielectric stacks.
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页数:3
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