Laser slicing: A thin film lift-off method for GaN-on-GaN technology

被引:34
作者
Voronenkov, Vladislav [1 ,2 ]
Bochkareva, Natalia [2 ]
Gorbunov, Ruslan [1 ,2 ]
Zubrilov, Andrey [1 ,2 ]
Kogotkov, Viktor [1 ]
Latyshev, Philipp [1 ]
Lelikov, Yuri [1 ,2 ]
Leonidov, Andrey [1 ]
Shreter, Yuri [1 ,2 ]
机构
[1] TRINITRI Technol LLC, St Petersburg, Russia
[2] Ioffe Inst, St Petersburg, Russia
关键词
Laser slicing; Lift-off; InGaN LED; GaN-on-GaN; VAPOR-PHASE-EPITAXY; LIGHT-EMITTING-DIODES; HETEROGENEOUS INTEGRATION; HVPE GROWTH; NITRIDE; BULK; SEPARATION; FABRICATION; DIAMOND; WAFERS;
D O I
10.1016/j.rinp.2019.102233
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A femtosecond laser focused inside bulk GaN was used to slice a thin GaN film with an epitaxial device structure from a bulk GaN substrate. The demonstrated laser slicing lift-off process did not require any special release layers in the epitaxial structure. GaN film with a thickness of 5 mu m and an InGaN LED epitaxial device structure was lifted off a GaN substrate and transferred onto a copper substrate. The electroluminescence of the LED chip after the laser slicing lift-off was demonstrated.
引用
收藏
页数:4
相关论文
共 53 条
[21]   Applications and theory of the solid immersion lens [J].
Kino, GS .
OPTICAL PULSE AND BEAM PROPAGATION, 1999, 3609 :56-66
[22]   Layered boron nitride as a release layer for mechanical transfer of GaN-based devices [J].
Kobayashi, Yasuyuki ;
Kumakura, Kazuhide ;
Akasaka, Tetsuya ;
Makimoto, Toshiki .
NATURE, 2012, 484 (7393) :223-227
[23]   Microstructuring of diamond bulk by IR femtosecond laser pulses [J].
Kononenko, T. V. ;
Meier, M. ;
Komlenok, M. S. ;
Pimenov, S. M. ;
Romano, V. ;
Pashinin, V. P. ;
Konov, V. I. .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2008, 90 (04) :645-651
[24]   Advanced dicing technology for semiconductor wafer - Stealth dicing [J].
Kumagai, Masayoshi ;
Uchiyama, Naoki ;
Ohmura, Etusji ;
Sugiura, Ryuji ;
Atsumi, Kazuhiro ;
Fukumitsu, Kenshi .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2007, 20 (03) :259-265
[25]   Natural substrate lift-off technique for vertical light-emitting diodes [J].
Lee, Chia-Yu ;
Lan, Yu-Pin ;
Tu, Po-Min ;
Hsu, Shih-Chieh ;
Lin, Chien-Chung ;
Kuo, Hao-Chung ;
Chi, Gou-Chung ;
Chang, Chun-Yen .
APPLIED PHYSICS EXPRESS, 2014, 7 (04)
[26]   A Novel Growth Method of Freestanding GaN Using In situ Removal of Si Substrate in Hydride Vapor Phase Epitaxy [J].
Lee, Moonsang ;
Mikulik, Dmitry ;
Kim, Joosung ;
Tak, Youngjo ;
Kim, Junyoun ;
Shim, Munbo ;
Park, Youngsoo ;
Chung, Uin ;
Yoon, Euijoon ;
Park, Sungsoo .
APPLIED PHYSICS EXPRESS, 2013, 6 (12)
[27]   High Performance of AlGaN/GaN HEMTs Reported on Adhesive Flexible Tape [J].
Lesecq, M. ;
Hoel, V. ;
des Etangs-Levallois, A. Lecavelier ;
Pichonat, E. ;
Douvry, Y. ;
De Jaeger, J. C. .
IEEE ELECTRON DEVICE LETTERS, 2011, 32 (02) :143-145
[28]   An AlN Sacrificial Buffer Layer Inserted into the GaN/Patterned Sapphire Substrate for a Chemical Lift-Off Process [J].
Lin, Chia-Feng ;
Dai, Jing-Jie ;
Lin, Ming-Shiou ;
Chen, Kuei-Ting ;
Huang, Wan-Chun ;
Lin, Chun-Min ;
Jiang, Ren-Hao ;
Huang, Yu-Chieh .
APPLIED PHYSICS EXPRESS, 2010, 3 (03)
[29]   Fabrication of freestanding 2"-GaN wafers by hydride vapour phase epitaxy and self-separation during cooldown [J].
Lipski, Frank ;
Wunderer, Thomas ;
Schwaiger, Stephan ;
Scholz, Ferdinand .
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2010, 207 (06) :1287-1291
[30]   Properties of free-standing GaN bulk crystals grown by HVPE [J].
Melnik, Y ;
Nikolaev, A ;
Nikitina, I ;
Vassilevski, K ;
Dmitriev, V .
NITRIDE SEMICONDUCTORS, 1998, 482 :269-274