Interfacial-shear strength of the perfluorocyclobutane films on silicon

被引:2
作者
Boddapati, Srinivasa Rao [1 ]
Ma, Hong [1 ]
Bordia, Rajendra K. [1 ]
Jen, Alex K-Y. [1 ]
机构
[1] Univ Washington, Dept Mat Sci & Engn, Seattle, WA 98195 USA
关键词
D O I
10.1557/JMR.2006.0207
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The debonding behavior of perfluorocyclobutane (PFCB) films on silicon (Si) has been investioated using Vickers indentation as a function of cure temperature and film thickness. PFCB films on Si were processed by spin coating (1-4 mu m) and solution casting (20-60 mu m). The interfacial shear strength of solution-cast PFCB films was independent of film thickness. The interfacial shear strength increased with cure temperature. The PFCB/Si cured at 225 degrees C exhibited interfacial shear strength of 123 MPa, and the strength increased to 163 MPa when the cure temperature was raised to 275 degrees C. The increase in interfacial-shear strength with temperature has been attributed to the increase in the density of bonds between PFCB and Si due to an increase in the density of crosslinks. Spin-coated films exhibited cracking due to the penetration of the indenter into the substrate, and the extent of cracking increased with the load.
引用
收藏
页码:1759 / 1769
页数:11
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