Microstructure and mechanical properties of Au60AgCu joints brazed with Sn63Pb solder

被引：0
|
作者：
Wang Xiuli [1 ]
Wang Xinhua [1 ]
机构：
[1] Beijing Inst Control Engn, Elect Assembly Ctr, Beijing, Peoples R China
来源：
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2017年
关键词：
Sn63Pb solder; Au60AgCu; shear strength; microstructure;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The joints of Au60AgCu alloy to silver and copper plated wire were obtained by using Sn63Pb solder, and the microstructure and mechanical properties of the brazing joints were investigated. The shear strength and the reliability of joints after the high and low temperature test were evaluated in this study.
引用
收藏
页码：212 / 214
页数：3
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