Experimental investigation of adhesively bonded patch repair of an inclined center cracked panel using DIC

被引:14
作者
Srilakshmi, R. [1 ]
Ramji, M. [1 ]
机构
[1] Indian Inst Technol Hyderabad, Dept Mech & Aerosp Engn, Engn Opt Lab, Yeddumailaram 502205, India
关键词
Digital image correlation; adhesively bonded repair; finite element analysis; optimization; genetic algorithm; DIGITAL IMAGE CORRELATION; MIXED-MODE FRACTURE; GENETIC ALGORITHM; COMPOSITE; DESIGN; OPTIMIZATION; SIZE;
D O I
10.1177/0731684414525245
中图分类号
TB33 [复合材料];
学科分类号
摘要
Repair of a cracked aircraft structure by an adhesively bonded composite patch has gained lot of importance in extending the fatigue life as well as improving the structural integrity of it. In the present work, an experimental study is carried out using digital image correlation (DIC) technique to analyze the behavior of single and double-sided adhesively bonded patch repair of an inclined center cracked aluminium panel subjected to uniaxial tensile loading. Further, the shear strain distribution in the adhesive layer is also estimated using the DIC technique. Shear strain concentration at the overlap edge in the adhesive layer is very high leading to patch debonding. Further, optimum patch dimension and patch thickness for the given cracked panel are arrived using a genetic algorithm-based optimization technique in conjunction with finite element analysis (FEA). With the optimum patch configuration, a 3-D FEA is further carried out and the obtained results are compared with the experimental prediction from DIC. The DIC prediction correlates with FEA contours on overall basis.
引用
收藏
页码:1130 / 1147
页数:18
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