Revolution in fan heat sink cooling technology to extend and maximize air cooling for high performance processors in laptop/desktop server application

被引:2
|
作者
Mochizuki, Masataka [1 ]
Saito, Yuji [1 ]
Nguyen, Thang [1 ]
Wuttijumnong, Vijit [1 ]
Wu, Xiaoping [1 ]
Nguyen, Tien [1 ]
机构
[1] Fujikura Ltd, Koto Ku, Tokyo 135, Japan
来源
ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C | 2005年
关键词
heat pipe; vapor chamber; computer cooling; fan heat sink;
D O I
10.1115/IPACK2005-73286
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The trend of the processor performance and heat dissipation have been increased significantly every year. In the year 2000, the clock speed of processors used in Personal Computers (PC) was approximately IGHz and heat dissipation approximately 20 W, but in the year 2004 the processor's clock speed is higher than 3 GHz and the heat dissipation is approaching 100 W. Heat dissipation has increased but in contrast the size of die on the processor has reduced or remained the same size and thus the heat flux is critically high. The heat flux is about 10-15 W/cm(2) in the year 2000 and Could reach 100 W/cm(2) in 2005. The purpose of this paper is to provide an overview of practical various cooling solutions including the use of heat pipes and vapor chambers for cooling high power processors in a confined space of PCs. This paper discusses how to extend the air cooling capability and maximize its performance. Included in this paper are the design, data, photos and discussion of various fan sink air cooling designs showing how the design changes can push the limit of the air cooling capability.
引用
收藏
页码:431 / 437
页数:7
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