共 50 条
- [1] Accuracy of wafer level alignment with substrate conformal imprint lithography JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2013, 31 (06):
- [2] PACKAGING WITH LASER WELDING SEMICONDUCTOR PRODUCTS AND SOLID STATE TECHNOLOGY, 1966, 9 (05): : 21 - &
- [6] Laser Welding and Packaging Technology of Three-dimensional Direct Plated Copper Ceramic Substrate Faguang Xuebao/Chinese Journal of Luminescence, 2024, 45 (03): : 506 - 515
- [7] A method for improving alignment precision of chip and substrate Zhongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Central South University (Science and Technology), 2010, 41 (01): : 184 - 189
- [8] Novel alignment technologies for wafer level packaging 2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 594 - 599
- [10] Precision laser welding of thin structures Welding Journal (Miami, Fla), 2010, 89 (07): : 38 - 41