Integrated Model and Compensation of Thermal Errors of Silicon Microelectromechanical Gyroscope

被引：33

作者：

Fang Jiancheng ^{[1
]}

Li Jianli ^{[1
]}

机构：

[1] Beijing Univ Aeronaut & Astronaut, Beijing 100083, Peoples R China

来源：

IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT | 2009年 / 58卷 / 09期

基金：

中国国家自然科学基金;

关键词：

Error analysis; error compensation; gyroscope; microelectromechanical devices; temperature; NOISE;

D O I：

10.1109/TIM.2009.2016780

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Based on the thermal interferential moment, the dynamic thermal error induced by accelerations of a microelectromechanical system (MEMS) gyroscope is analyzed. The electromechanical-thermal error is discussed. The integrated thermal error compensation method considering the electromechanical-thermal error and the dynamic thermal error induced by accelerations is proposed. The experimental results show that the bias temperature sensitivity is reduced by more than one order of magnitude compared with the raw bias temperature sensitivity of the gyroscope. The integrated compensation method is reasonable and effective in the temperature error compensation of the MEMS gyroscope and outperforms the classical compensation method in performance.

引用

页码：2923 / 2930

页数：8

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