An Investigation of Microstructure and Mechanical Properties of Sn-9Zn-xCr Alloys Produced by Investment Casting Method

被引:1
作者
Yavuzer, B. [1 ]
Ozyurek, D. [1 ]
机构
[1] Karabuk Univ, Fac Technol, Mfg Engn, TR-78100 Karabuk, Turkey
关键词
LEAD-FREE SOLDER; PB-FREE SOLDERS; SN-ZN; CORROSION-RESISTANCE; TENSILE PROPERTIES; ALKALINE-SOLUTION; BEHAVIOR; CU; MICROHARDNESS; AG;
D O I
10.12693/APhysPolA.131.102
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
In this study, the microstructure and mechanical properties were investigated of different amount Cr (0.1%, 0.5%, 0.9%) added Sn-9Zn eutectic alloys and Weibull statistical analyses were evaluated using ultimate tensile strength. Pure elements (Sn, Zn, Cr) were used for production of alloys and pre-alloying was done and waited in the electrical resistance furnace at 450 degrees C for 1 h to homogenized and poured as ingot in plaster moulds. Then pre-alloyed Sn-9Zn-x Cr ingots were melted and poured at 300 degrees C in ceramic moulds prepared investment casting method. As a result of the study, the highest hardness and ultimate tensile strength values were measured in the Sn-9Zn alloy with 0.1% Cr. It was determined that while ultimate tensile strength was decreased, percentage of elongation was increased by increase of Cr amount. According to the Weibull statistical analyses results, the highest Weibull module was calculated by Sn-9Zn-0.1Cr alloy ultimate tensile strength values.
引用
收藏
页码:102 / 105
页数:4
相关论文
共 26 条
[1]   Lead-free solders in microelectronics [J].
Abtew, M ;
Selvaduray, G .
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2000, 27 (5-6) :95-141
[2]   Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders [J].
Adnan Islam, Rashed ;
Chan, Y. C. ;
Jillek, W. ;
Islam, Samia .
MICROELECTRONICS JOURNAL, 2006, 37 (08) :705-713
[3]   Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy [J].
Chen, KI ;
Cheng, SC ;
Wu, S ;
Lin, KL .
JOURNAL OF ALLOYS AND COMPOUNDS, 2006, 416 (1-2) :98-105
[4]   Study on the properties of Sn-9Zn-xCr lead-free solder [J].
Chen, Xi ;
Hu, Anmin ;
Li, Ming ;
Mao, Dali .
JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 460 (1-2) :478-484
[5]   Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn-9Zn binary eutectic solder alloy [J].
Das, S. K. ;
Sharif, A. ;
Chan, Y. C. ;
Wong, N. B. ;
Yung, W. K. C. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 481 (1-2) :167-172
[6]   The effect of undercooling on the microstructure and tensile properties of hypoeutectic Sn-6.5Zn-xCu Pb-free solders [J].
El-Daly, A. A. ;
Desoky, W. M. ;
Saad, A. F. ;
Mansor, N. A. ;
Lotfy, E. H. ;
Abd-Elmoniem, H. M. ;
Hashem, H. .
MATERIALS & DESIGN, 2015, 80 :152-162
[7]   Elastic properties and thermal behavior of Sn-Zn based lead-free solder alloys [J].
El-Daly, A. A. ;
Hammad, A. E. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 505 (02) :793-800
[8]   Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn-9Zn lead-free solders [J].
El-Daly, A. A. ;
Hammad, A. E. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2010, 527 (20) :5212-5219
[9]   Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads [J].
Fouzder, Tama ;
Gain, Asit Kumar ;
Chan, Y. C. ;
Sharif, A. ;
Yung, Winco K. C. .
MICROELECTRONICS RELIABILITY, 2010, 50 (12) :2051-2058
[10]   Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages [J].
Gain, Asit Kumar ;
Chan, Y. C. ;
Sharif, Ahmed ;
Wong, N. B. ;
Yung, Winco K. C. .
MICROELECTRONICS RELIABILITY, 2009, 49 (07) :746-753