A simple 1-transistor capacitor-less memory cell for high performance embedded DRAMs

被引:20
作者
Fazan, PC [1 ]
Okhonin, S [1 ]
Nagoga, M [1 ]
Sallese, JM [1 ]
机构
[1] Innovat Silicon Solut, CH-2525 Le Landeron, Switzerland
来源
PROCEEDINGS OF THE IEEE 2002 CUSTOM INTEGRATED CIRCUITS CONFERENCE | 2002年
关键词
D O I
10.1109/CICC.2002.1012775
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
A new compact memory architecture is proposed for embedded Dynamic Random Access Memory (eDRAM) cells. By exploiting the floating body effect of partially depleted Silicon On Insulator (SOI) devices, a one-transistor memory cell can be integrated in a pure logic SOI technology without adding any process step. The data retention, device operation principles and reliability make it ideal for high performance eDRAM applications while reducing the cell area by a factor of two.
引用
收藏
页码:99 / 102
页数:4
相关论文
共 10 条
[1]   A HIGH-SPEED CLAMPED BIT-LINE CURRENT-MODE SENSE AMPLIFIER [J].
BLALOCK, TN ;
JAEGER, RC .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1991, 26 (04) :542-548
[2]  
Hamada M., 1999, International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318), P45, DOI 10.1109/IEDM.1999.823843
[3]   Embedded DRAM technologies [J].
Ishiuchi, H ;
Yoshida, T ;
Takato, H ;
Tomioka, K ;
Matsuo, K ;
Momose, H ;
Sawada, S ;
Yamazaki, K ;
Maeguchi, K .
INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, 1997, :33-36
[4]   Embedded DRAM technology: opportunities and challenges [J].
Iyer, SS ;
Kalter, HL .
IEEE SPECTRUM, 1999, 36 (04) :56-64
[5]  
Okhonin S., 2001, IEEE INT SOI C, P153
[6]  
PELLA M, 2001, P IEEE INT SOI C, P1
[7]  
*SA 27E CU 11 TECH, 2001, IBM EMB DRAM
[8]   Foundry technology for the next decade [J].
Sun, JYC ;
Chiang, SY ;
Liu, M .
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, :321-324
[9]  
TAKEUCHI M, 2001, S VLSI TECH, P33
[10]  
Yoshida M., 1999, International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318), P41, DOI 10.1109/IEDM.1999.823842