3D sensors and micro-fabricated detector systems

被引：5
|
作者：
Da Via, Cinzia [1 ]
机构：
[1] Univ Manchester, Sch Phys & Astron, Manchester M13 9PL, Lancs, England
来源：
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT | 2014年 / 765卷
基金：
美国国家卫生研究院;
关键词：
3D silicon sensor; MEMS; 3D integration; ATLAS pixel upgrade; LHC upgrade; FE-I4; Pixels; Radiation hardness. Micro-channel-cooling; 3D printing; SILICON DETECTORS;
D O I：
10.1016/j.nima.2014.05.087
中图分类号：
TH7 [仪器、仪表];
学科分类号：
0804 ; 080401 ; 081102 ;
摘要：
Micro-systems based on the Micro Electro Mechanical Systems (MEMS) technology have been used in miniaturized low power and low mass smart structures in medicine, biology and space applications. Recently similar features found their way inside high energy physics with applications in vertex detectors for high-luminosity LHC Upgrades, with 3D sensors, 3D integration and efficient power management using silicon micro-channel cooling. This paper reports on the state of this development. (C) 2014 The Author. Published by Elsevier BA/.
引用
收藏
页码：151 / 154
页数：4
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