Fast algorithms for 3-D simulation

被引:0
|
作者
White, J [1 ]
机构
[1] MIT, Elect Res Lab, Dept Elect Engn & Comp Sci, Cambridge, MA 02139 USA
关键词
integral equations; fast solvers;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
One difficulty associated with computer simulation of micromachined devices is that the devices are typically geometrically complicated and innately three-dimensional. For this reason, attempts to exploit existing finite-element based tools for micromachined device simulation has proved difficult. Instead, micromachine device designers have been early adopters of the recently developed accelerated boundary-element methods. In this short paper the author will describe a little of the history of these methods, primarily to point the interested reader to the relevant literature.
引用
收藏
页码:1 / 3
页数:3
相关论文
共 50 条
  • [1] Fast algorithms for 3-D dominance reporting and counting
    Shi, QM
    JaJa, J
    INTERNATIONAL JOURNAL OF FOUNDATIONS OF COMPUTER SCIENCE, 2004, 15 (04) : 673 - 684
  • [2] Fast 3-D algorithm for the 3-D IDCT
    Alshibami, O
    Boussakta, S
    Darnell, M
    PARALLEL AND DISTRIBUTED COMPUTING, APPLICATIONS AND TECHNOLOGIES, PDCAT'2003, PROCEEDINGS, 2003, : 825 - 828
  • [3] ALGORITHMS FOR COUPLED TRANSIENT SIMULATION OF CIRCUITS AND COMPLICATED 3-D PACKAGING
    SILVEIRA, LM
    KAMON, M
    WHITE, J
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (01): : 92 - 98
  • [5] 3-D Voronoi tessellation algorithms
    Tomio Hirata
    Japan Journal of Industrial and Applied Mathematics, 2005, 22 : 223 - 231
  • [6] 3-D Voronoi tessellation algorithms
    Hirata, T
    JAPAN JOURNAL OF INDUSTRIAL AND APPLIED MATHEMATICS, 2005, 22 (02) : 223 - 231
  • [7] Algorithms in FastImp: A fast and wideband impedance extraction program for complicated 3-D geometries
    Zhu, ZH
    Song, B
    White, J
    40TH DESIGN AUTOMATION CONFERENCE, PROCEEDINGS 2003, 2003, : 712 - 717
  • [8] 3-D simulation of FINFET
    Liu, Enfeng
    Liu, Xiaoyan
    Han, Ruqi
    Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors, 2002, 23 (09): : 909 - 913
  • [9] 3-D VISUAL SIMULATION
    GOLDSTEIN, RA
    NAGEL, R
    SIMULATION, 1971, 16 (01) : 25 - +
  • [10] A fast path-based method for 3-D resist development simulation
    Dai, Q.
    Guo, R.
    Lee, S. -Y.
    Choi, J.
    Lee, S. -H.
    Shin, I. -K.
    Jeon, C. -U.
    Kim, B. -G.
    Cho, H. -K.
    MICROELECTRONIC ENGINEERING, 2014, 127 : 86 - 96