A novel positive working photosensitive polyimide for wafer-level CSP packages

被引:6
作者
Yuba, T [1 ]
Suwa, M [1 ]
Fujita, Y [1 ]
Tomikawa, M [1 ]
Ohbayashi, G [1 ]
机构
[1] Toray Industries Ltd, Elect & Imaging Mat Res Labs, Otsu, Shiga 5200842, Japan
关键词
chemical resistance; inter layer dielectrics; flux; stripper;
D O I
10.2494/photopolymer.15.201
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
[No abstract available]
引用
收藏
页码:201 / 203
页数:3
相关论文
共 3 条
  • [1] EI K, 2001, SEMICONDUCTOR PACKAG, pCH1
  • [2] SAKAMOTO K, 1997, J PHOTOPOLYMER SCI T, V10, P625
  • [3] TOMOKAWA M, 2000, J PHOTOPOLYMER SCI T, V13, P357