Au-Sn Co-electroplating solution for Flip Chip-LED Bumps

被引:0
作者
Pan, Jianling [1 ]
Huang, Mingliang [1 ]
机构
[1] Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China
来源
2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) | 2010年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new non-cyanide and non-toxic stable electroplating solution for co-deposition Au-Sn alloys was investigated in this study. A stable sulfite-based electroplating solution for gold and a stable solution for tin were prepared, respectively. L-ascorbic acid was added into the Au solution and a reducing agent was added into the Sn solution, and then the two solutions were mixed to generate Au-Sn solution. The effects of additives on solution stability at room temperature and high temperatures were studied. Polarization tests of Au, Sn and Au-Sn solutions were carried out to reveal the effect of additives on Au, Sn and Au-Sn plating. Then a series of electroplating tests at different current densities were performed in order to demonstrate plating capability of Au-Sn solutions. It was shown that the species of the main salt for gold affected the stability of solution prominently. EDTA could improve the stability of Au solution at high temperature and the complexing agent for Sn was also benefit to the stability of Sn solution. Two waves in Sn solutions with the complexing agent indicated two cathode reactions occurred during Sn plating. The reducing agent was added to prevent the oxidation of Sn (II), but it turned out to affect the polarization of Sn solutions and the compositions of Au-Sn alloys during co-electroplating. Electroplating experiment results showed that co-electroplating of uniform Au-Sn deposits was feasible.
引用
收藏
页码:283 / 287
页数:5
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