Nickel-tin solid-liquid inter-diffusion bonding

被引：24

作者：

Yu, Chen-Chiang ^{[1
,2
]}

Su, Pei-Chen ^{[2
,3
]}

Bai, Seoung Jai ^{[4
]}

Chuang, Tung-Han ^{[5
]}

机构：

[1] Nanyang Technol Univ, Interdisciplinary Grad Sch, Singapore 639798, Singapore

[2] Natl Taiwan Univ, Dept Mech Engn, Taipei, Taiwan

[3] Nanyang Technol Univ, Sch Mech & Aerosp Engn, Singapore 639798, Singapore

[4] Dankook Univ, Dept Mech Engn, Seoul, South Korea

[5] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei, Taiwan

来源：

INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING | 2014年 / 15卷 / 01期

基金：

新加坡国家研究基金会;

关键词：

Solid Liquid Inter-Diffusion Bonding; Electronic Packaging; MEMS Technology; SN-PB SOLDER; INTERFACIAL REACTION; AU-IN; NI; CU; DIFFUSION; METALLIZATION; TEMPERATURE; KINETICS; SYSTEMS;

D O I：

10.1007/s12541-013-0317-2

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents a solid liquid inter-diffusion (SLID) bonding process using nickel-tin. By using two metals with different melting points, Ni3Sn4, an intermetallic compound (IMC) at 523K was formed. Unlike pure metal, the IMC can be used in high temperature applications of up to 800K without failure. The formation energy of Ni3Sn4 IMC was calculated to be 23.15 kJ/mol from the experimental result. Compared to the traditional soldering technique, a higher temperature resistance bonding joint can be achieved using the nickel-tin SLID bonding technique.

引用

页码：143 / 147

页数：5

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