Gate Bias and Length Dependences of Total Ionizing Dose Effects in InGaAs FinFETs on Bulk Si

被引:25
作者
Zhao, Simeng E. [1 ]
Bonaldo, Stefano [2 ]
Wang, Pan [1 ]
Jiang, Rong [1 ]
Gong, Huiqi [1 ]
Zhang, En Xia [1 ]
Waldron, Niamh [3 ]
Kunert, Bernardette [3 ]
Mitard, Jerome [3 ]
Collaert, Nadine [3 ]
Sioncke, Sonja [3 ]
Linten, Dimitri [3 ]
Schrimpf, Ronald D. [1 ]
Reed, Robert A. [1 ]
Gerardin, Simone [2 ]
Paccagnella, Alessandro [2 ]
Fleetwood, Daniel M. [1 ]
机构
[1] Vanderbilt Univ, Dept Elect Engn & Comp Sci, Nashville, TN 37235 USA
[2] Univ Padua, Dept Informat Engn, I-35122 Padua, Italy
[3] IMEC, B-3001 Leuven, Belgium
关键词
1/f noise; III-V; border trap; bulk Si; FinFETs; gate-length dependence; InGaAs; total ionizing dose (TID); LOW-FREQUENCY NOISE; 1/F NOISE; III-V; TEMPERATURE-DEPENDENCE; INTERFACE TRAPS; BORDER TRAPS; MOS; GE; DEFECTS; DEVICES;
D O I
10.1109/TNS.2019.2890827
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We evaluate the total ionizing dose (TID) responses of InGaAs nMOS FinFETs with different gate lengths irradiated with 10-keV X-rays under different gate biases. The largest degradation after irradiation occurs at VG = -1 V. Radiation-induced trapped positive charge dominates the TID response of InGaAs FinFET transistors, consistent with previous results for InGaAs multifin capacitors. Shorter gate-length devices show larger radiation-induced charge trapping than longer gate-length devices, most likely due to the electrostatic effects of trapped charge in the surrounding SiO2 isolation and SiO2/Si3N4 spacer oxides. The 1/f noise measurements indicate a high trap density and a nonuniform defect-energy distribution, consistent with a strong variation of effective border-trap density with surface potential.
引用
收藏
页码:1599 / 1605
页数:7
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