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Gate Bias and Length Dependences of Total Ionizing Dose Effects in InGaAs FinFETs on Bulk Si
被引:25
作者:
Zhao, Simeng E.
[1
]
Bonaldo, Stefano
[2
]
Wang, Pan
[1
]
Jiang, Rong
[1
]
Gong, Huiqi
[1
]
Zhang, En Xia
[1
]
Waldron, Niamh
[3
]
Kunert, Bernardette
[3
]
Mitard, Jerome
[3
]
Collaert, Nadine
[3
]
Sioncke, Sonja
[3
]
Linten, Dimitri
[3
]
Schrimpf, Ronald D.
[1
]
Reed, Robert A.
[1
]
Gerardin, Simone
[2
]
Paccagnella, Alessandro
[2
]
Fleetwood, Daniel M.
[1
]
机构:
[1] Vanderbilt Univ, Dept Elect Engn & Comp Sci, Nashville, TN 37235 USA
[2] Univ Padua, Dept Informat Engn, I-35122 Padua, Italy
[3] IMEC, B-3001 Leuven, Belgium
关键词:
1/f noise;
III-V;
border trap;
bulk Si;
FinFETs;
gate-length dependence;
InGaAs;
total ionizing dose (TID);
LOW-FREQUENCY NOISE;
1/F NOISE;
III-V;
TEMPERATURE-DEPENDENCE;
INTERFACE TRAPS;
BORDER TRAPS;
MOS;
GE;
DEFECTS;
DEVICES;
D O I:
10.1109/TNS.2019.2890827
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
We evaluate the total ionizing dose (TID) responses of InGaAs nMOS FinFETs with different gate lengths irradiated with 10-keV X-rays under different gate biases. The largest degradation after irradiation occurs at VG = -1 V. Radiation-induced trapped positive charge dominates the TID response of InGaAs FinFET transistors, consistent with previous results for InGaAs multifin capacitors. Shorter gate-length devices show larger radiation-induced charge trapping than longer gate-length devices, most likely due to the electrostatic effects of trapped charge in the surrounding SiO2 isolation and SiO2/Si3N4 spacer oxides. The 1/f noise measurements indicate a high trap density and a nonuniform defect-energy distribution, consistent with a strong variation of effective border-trap density with surface potential.
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页码:1599 / 1605
页数:7
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