Thermal properties of ultra-thin copper nanobridges

被引:28
作者
Kang, JW [1 ]
Hwang, HJ [1 ]
机构
[1] Chung Ang Univ, Dept Elect Engn, Semicond Proc & Device Lab, DongJak Ku, Seoul 156756, South Korea
关键词
D O I
10.1088/0957-4484/13/4/313
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
We have investigated several ultra-thin copper nanobridges between supporting layers using a classical molecular dynamics simulation and a many-body potential function of the second-moment approximation of the tight-binding scheme. When the nanobridge has a well-defined structure, the resonance frequency of the nanobridge is defined and the resonance phenomenon is in common with classical oscillation systems. The caloric curve and the diffusivity of the nanobridge have shown information on the melting and the breaking of the nanobridge. The supporting layers of the nanobridge play an important role in the dynamics and thermal properties of nanobridges.
引用
收藏
页码:503 / 509
页数:7
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