The preferential growth behaviors of the intermetallics at the W/Co interface during spark plasma sintering

被引:15
作者
Deng, Shenghua [1 ]
Li, Ruidi [2 ]
Yuan, Tiechui [2 ]
Yang, Pan [3 ]
Xie, Siyao [2 ]
Li, Jianan [1 ]
机构
[1] Jiangxi Univ Sci & Technol, Fac Mat Met & Chem, Ganzhou 341000, Peoples R China
[2] Cent South Univ, State Key Lab Powder Met, Changsha 410083, Peoples R China
[3] Western Sydney Univ, Sch Engn, Locked Bag 1797, Penrith, NSW 2751, Australia
关键词
ENHANCED DENSIFICATION KINETICS; ELECTRIC-CURRENT; MECHANICAL-PROPERTIES; CRYSTAL ORIENTATION; GRAIN-ORIENTATION; DENDRITIC GROWTH; ELECTROMIGRATION; RESISTANCE; TUNGSTEN; RESISTIVITY;
D O I
10.1063/5.0026092
中图分类号
O59 [应用物理学];
学科分类号
摘要
The strong electric current in spark plasma sintering (SPS) often gives sintered materials unique microstructures. In the present study, it is found that the Co3W grains formed at the W/Co bonding interface preferentially grow along [2 1 <overbar></mml:mover> <mml:mover accent="true"> 1 <mml:mo><overbar></mml:mover>0] (or its equivalent orientations) in the current direction during SPS, which is significantly different from that without current. We propose that the resistance anisotropy of grains under electromigration leads to anisotropic atomic diffusion, inducing the preferential growth of grains under current. This work may provide an approach and a theoretical foundation for the preparation of materials exhibiting directional growth.
引用
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页数:5
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