High Moisture Accelerated Mechanical Behavior Degradation of Phosphor/Silicone Composites Used in White Light-Emitting Diodes

被引:21
作者
Fan, Jiajie [1 ,2 ,3 ]
Wang, Zhen [1 ,2 ]
Zhang, Xunwei [1 ]
Deng, Zhentao [4 ]
Fan, Xuejun [5 ]
Zhang, Guoqi [3 ]
机构
[1] Hohai Univ, Coll Mech & Elect Engn, Changzhou 213022, Peoples R China
[2] Changzhou Inst Technol Res Solid State Lighting, State Key Lab Solid State Lighting, Changzhou 213164, Peoples R China
[3] Delft Univ Technol, EEMCS Fac, Dept Microelect, NL-2628 Delft, Netherlands
[4] Shenzhen Univ, Coll Chem & Environm Engn, Shenzhen 518061, Peoples R China
[5] Lamar Univ, Dept Mech Engn, Beaumont, TX 77710 USA
基金
中国国家自然科学基金;
关键词
light-emitting diode; phosphor; silicone composite; curing mechanism; mechanical properties; moisture; LED PACKAGE; PHOSPHOR;
D O I
10.3390/polym11081277
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
In a high-power white light emitting diode (LED) package, the phosphor/silicone composite is typically used for photometric and colorimetric conversions, ultimately producing the white light. However, the phosphor/silicone composite is always exposed under harsh environments with high temperature, high blue light irradiation and high moisture when the LED operates. Therefore, its reliability issue has become one of the critical bottlenecks to improve the lifetime of a high-power white LED package. As the curing process and mechanical behavior of phosphor/silicone composite essentially determine its reliability, this paper firstly uses an in situ viscosity monitoring approach combined with Differential Scanning Calorimetry (DSC) and Fourier Transform Infrared Spectroscopy (FTIR) analysis to explain the curing mechanism of a phosphor/silicone composite by taking the effects of temperature and phosphor mass fraction into consideration. Then, the mechanical properties of phosphor/silicone composites aged under a long-term high moisture condition are evaluated by using the tensile test. Meanwhile, the finite element (FE) simulations, the Mori-Tanaka theoretical estimations and the microstructure analysis are applied to investigate the high moisture induced degradation mechanisms. The results show that: (1) the in situ measured isothermal viscosity curves of both pristine silicone and phosphor/silicone composites follow the Arrhenius empirical model, and high temperature and high phosphor mass fraction can increase the curing rate; (2) the hydrosilylation reaction between silicones determines the curing mechanism of phosphor/silicone composite; (3) the tensile test, FE simulation and Mori-Tanaka theoretical prediction results confirm that the Young's modulus of phosphor/silicone composite increases by gradually adding phosphors; and (4) the Young's modulus of phosphor/silicone composite increases after the high moisture ageing test, which can be attributed to the oxidation and cross-linking reaction of silicone and the hydrolysis of phosphor powders.
引用
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页数:16
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