A 0.6 V, 1.5 GHz 84 Mb SRAM in 14 nm FinFET CMOS Technology With Capacitive Charge-Sharing Write Assist Circuitry

被引:39
作者
Karl, Eric [1 ]
Guo, Zheng [1 ]
Conary, James [2 ]
Miller, Jeffrey [3 ]
Ng, Yong-Gee [1 ]
Nalam, Satyanand [1 ]
Kim, Daeyeon [1 ]
Keane, John [1 ]
Wang, Xiaofei [1 ]
Bhattacharya, Uddalak [1 ]
Zhang, Kevin [1 ]
机构
[1] Intel Corp, Log Technol Dev, Adv Design, Hillsboro, OR 97124 USA
[2] Intel Corp, Intel Custom Foundry, Compiler Memory Org, Hillsboro, OR 97124 USA
[3] Intel Corp, Platform Engn Grp, Device Dev Grp, Hillsboro, OR 97124 USA
关键词
CMOS integrated circuits; semiconductor memory; SRAM;
D O I
10.1109/JSSC.2015.2461592
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A 0.6-1.1 V, 84 Mb pipelined SRAM array design implemented in 14 nm FinFET CMOS technology is presented. Two array architectures featuring a high-density 0.0500 mu m(2) 6T SRAM bitcell and a 0.0588 mu m(2) 6T SRAM bitcell targeting low voltage operation are detailed. The high-density array design reaches 2.7 GHz at 1.1 V with 14.5 Mb/mm(2) bit density, while the low voltage optimized array can operate at 0.6 V, 1.5 GHz under typical process conditions. A capacitive charge-share transient voltage collapse write-assist circuit (CS-TVC) enables a 24% reduction in write energy compared to previous techniques by eliminating bias currents during operation. Technology and assist co-optimization enable >50 mV reduction in V-MIN and a 1.81x increase in density over a 22 nm design.
引用
收藏
页码:222 / 229
页数:8
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