Self-assembled three-dimensional structure of epoxy/polyethersulphone/silver adhesives with electrical conductivity

被引：35

作者：

Kishi, Hajime ^{[1
]}

Tanaka, Sanae ^{[1
]}

Nakashima, Yasuaki ^{[1
]}

Saruwatari, Takashi ^{[1
]}

机构：

[1] Univ Hyogo, Grad Sch Engn, 2167 Shosha, Himeji, Hyogo 6712201, Japan

来源：

POLYMER | 2016年 / 82卷

关键词：

Functional adhesives; Epoxy; Electrical conductivity; SILVER NANOPARTICLES; EPOXY COMPOSITES; LOW-TEMPERATURE; POLYMER BLENDS; CARBON-BLACK; NANOCOMPOSITES; MORPHOLOGY; PARTICLES; SULFONE); BEHAVIOR;

D O I：

10.1016/j.polymer.2015.11.043

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Diglycidyl ethers of bisphenol-A (DGEBA)/4,4'-diaminodiphenylmethane (DDM)/polyethersulphone (PES) blends were prepared as matrix resins for electrically conductive adhesives containing silver (Ag) fillers. The epoxy/PES blends formed co-continuous phase structures from initial homogeneous solutions via reaction-induced phase separation during the curing process. The Ag fillers were selectively localized in the epoxy-rich phases that had high affinity toward the surface of the Ag fillers. The co-continuous phase structures of the epoxy/PES blends acted as templates for the three-dimensional continuous structures of the Ag fillers. The self-assembled structures of the Ag fillers were connected in a continuous phase that possessed high electrical conductivity using a relatively small amount of Ag filler. In addition, the epoxy/PES/Ag adhesives had excellent shear adhesive strength. The fracture toughness of the epoxy/PES blends was the source of the high adhesive strength. (C) 2015 Elsevier Ltd. All rights reserved.

引用

页码：93 / 99

页数：7

共 24 条

[1] Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro-silver flakes and nano-silver spheres for electronic packaging [J].

Cui, Hui-wang ;

Fan, Qiong ;

Li, Dong-sheng .

POLYMER INTERNATIONAL, 2013, 62 (11) :1644-1651

[2]

Falat T., 2006, P 30 INT C IMAPS POL

[3] Pressureless sintering of nanosilver paste at low temperature to join large area (≥100 mm2) power chips for electronic packaging [J].

Fu, Shancan ;

Mei, Yunhui ;

Lu, Guo-Quan ;

Li, Xin ;

Chen, Gang ;

Chen, Xu .

MATERIALS LETTERS, 2014, 128 :42-45

[4] Electrical properties of epoxy/silver nanocomposites [J].

Gonon, P ;

Boudefel, A .

JOURNAL OF APPLIED PHYSICS, 2006, 99 (02)

[5] SELECTIVE LOCALIZATION OF CARBON-BLACK IN IMMISCIBLE POLYMER BLENDS - A USEFUL TOOL TO DESIGN ELECTRICAL CONDUCTIVE COMPOSITES [J].

GUBBELS, F ;

JEROME, R ;

TEYSSIE, P ;

VANLATHEM, E ;

DELTOUR, R ;

CALDERONE, A ;

PARENTE, V ;

BREDAS, JL .

MACROMOLECULES, 1994, 27 (07) :1972-1974

[6] CHEMICAL MODIFICATION OF MATRIX RESIN NETWORKS WITH ENGINEERING THERMOPLASTICS .1. SYNTHESIS, MORPHOLOGY, PHYSICAL BEHAVIOR AND TOUGHENING MECHANISMS OF POLY(ARYLENE ETHER SULFONE) MODIFIED EPOXY NETWORKS [J].

HEDRICK, JL ;

YILGOR, I ;

JUREK, M ;

HEDRICK, JC ;

WILKES, GL ;

MCGRATH, JE .

POLYMER, 1991, 32 (11) :2020-2032

[7]

Inoue M., 2009, T JPN I ELECT PACKAG, V2, P125

[8] Electrical characteristics of a new class of conductive adhesive [J].

Jeong, WJ ;

Nishikawa, H ;

Itou, D ;

Takemoto, T .

MATERIALS TRANSACTIONS, 2005, 46 (10) :2276-2281

[9] Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites [J].

Jiang, Hongjin ;

Moon, Kyoung-sik ;

Li, Yi ;

Wong, C. P. .

CHEMISTRY OF MATERIALS, 2006, 18 (13) :2969-2973

[10] Shear ductility and toughenability study of highly cross-linked epoxy/polyethersulphone [J].

Kishi, H ;

Shi, YB ;

Huang, J ;

Yee, AF .

JOURNAL OF MATERIALS SCIENCE, 1997, 32 (03) :761-771

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