Design of a Broadband Common-Mode Filter With Four Transmission Zeros

被引:14
作者
Ch, Chao-Kai [1 ,2 ]
Cheng, Chi-Hsuan [1 ,2 ]
Wu, Tzong-Lin [1 ,2 ]
机构
[1] Natl Taiwan Univ, Dept Elect Engn, Taipei 10617, Taiwan
[2] Natl Taiwan Univ, Grad Inst Commun Engn, Taipei 10617, Taiwan
关键词
Common-mode filter (CMF) differential signaling; electromagnetic interference (EMI); transmission zero (TZ); SUPPRESSION; RADIATION; CIRCUIT; EMI; RESONATORS; LINES;
D O I
10.1109/TEMC.2018.2881321
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a design methodology on the broadband common-mode filter (CMF) with four transmission zeros for solving electromagnetic interference in high-speed differential digital systems. An equivalent circuit model is established based on the mushroom structure to characterize the common-mode bandstop response, and the simplified transmission zeros condition is derived to predict the transmission zeros. Furthermore, the design criteria as well as design flow through the simplified transmission zeros condition can be employed to synthesize the four zeros CMF systematically. Finally, in order to verify the proposed design methodology, a broadband CMF with four transmission zeros is fabricated on a four-layer printed circuit board. The experimental results show that the proposed CMF can reduce the common-mode noise over 10 dB from 1.23 to 5.15 GHz with a fractional bandwidth of 123%. Compared with other literature on mushroom-like CMFs, the proposed CMF has the widest common-mode suppression bandwidth. The electrical size is only 0.0427 lambda(2)(g), where lambda(g) is the guided wavelength of the central frequency of its common-mode stopband. The insertion loss of differential mode is below 3 dB from dc to 8.5 GHz. In addition, the measured eye diagram of the proposed CMF indicates that it maintains good signal integrity for high-speed differential signals.
引用
收藏
页码:1052 / 1060
页数:9
相关论文
共 27 条
[1]  
[Anonymous], 2011, MICROWAVE ENG
[2]  
Archambeault B., 2007, P IEEE INT EL COMP S, P1
[3]   Investigation of the Radiated Emissions From High-Speed/High-Density Connectors [J].
Chen, Hung-Chuan ;
Connor, Samuel ;
Halligan, Matthew S. ;
Tian, Xinxin ;
Li, Xiao ;
Archambeault, Bruce ;
Drewniak, James L. ;
Wu, Tzong-Lin .
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2016, 58 (01) :220-230
[4]   An Ultracompact TSV-Based Common-Mode Filter (TSV-CMF) in Three-Dimensional Integrated Circuits (3-D ICs) [J].
Cheng, Chi-Hsuan ;
Wu, Tzong-Lin .
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2016, 58 (04) :1128-1135
[5]   The impact of a nonideal return path on differential signal integrity [J].
Fornberg, PE ;
Kanda, M ;
Lasek, C ;
Piket-May, M ;
Hall, SH .
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2002, 44 (01) :11-15
[6]  
Hall S., 2009, Advanced Signal Integrity for High Speed Digital Designs, DOI 10.1002/9780470423899
[7]   Quantifying EMI resulting from finite-impedance reference planes [J].
Hockanson, DM ;
Drewniak, JL ;
Hubing, TH ;
VanDoren, TP ;
Sha, F ;
Lam, CW ;
Rubin, L .
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 1997, 39 (04) :286-297
[8]   Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables [J].
Hockanson, DM ;
Drewniak, JL ;
Hubing, TH ;
VanDoren, TP ;
Sha, F ;
Wilhelm, MJ .
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 1996, 38 (04) :557-566
[9]   FDTD and experimental investigation of EMI from stacked-card PCB configurations [J].
Hockanson, DM ;
Ye, XN ;
Drewniak, JL ;
Hubing, TH ;
Van Doren, TP ;
DuBroff, RE .
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2001, 43 (01) :1-10
[10]   An Ultra-Compact Common-Mode Bandstop Filter With Modified-T Circuits in Integrated Passive Device (IPD) Process [J].
Hsiao, Chih-Ying ;
Huang, Yang-Chih ;
Wu, Tzong-Lin .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2015, 63 (11) :3624-3631