Thermal management of micro-hotplates using MEMCAD as simulation tool

被引：0

作者：

Briand, D ^{[1
]}

Grétillat, MA ^{[1
]}

van der Schoot, B ^{[1
]}

de Rooij, NF ^{[1
]}

机构：

[1] Inst Microtechnol, CH-2007 Neuchatel, Switzerland

来源：

2000 INTERNATIONAL CONFERENCE ON MODELING AND SIMULATION OF MICROSYSTEMS, TECHNICAL PROCEEDINGS | 2000年

关键词：

micro-hotplates; FEM simulation; MEMCAD; thermal; gas sensors;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper we report on the electrothermal simulations per-formed in the aim of optimising the power consumption and the temperature distribution of micro-hotplates for gas sensing applications. The micro-hotplate designs were optimised using the software MEMCAD from Microcosm Technologies. From the results obtained, we propose a micro-hotplate design with a silicon island underneath the membrane. The silicon island ensures an uniform temperature over the sensing area for the metal-oxide gas sensors. Moreover, it allows to thermally isolating electronic components and was used to lower the power consumption of MOSFET gas sensors. The optimised micro-hotplates are suitable for. applications in the automotive industry and in electronic nose instruments.

引用

页码：640 / 643

页数：4

共 43 条

[21] TOOL SHEAR STREES AND TEMPERATURE DISTRIBUTIONS PREDICTION USING FEM SIMULATION [J].

Patrascu, Gabriela ;

Carutasu, Nicoleta Luminita .

ANNALS OF DAAAM FOR 2008 & PROCEEDINGS OF THE 19TH INTERNATIONAL DAAAM SYMPOSIUM, 2008, :1043-1044

[22] A simulation study of IC layout effects on thermal management of die attached GaAsICs [J].

Reimer, CJ ;

Smy, T ;

Walkey, DJ ;

Beggs, BC ;

Surridge, R .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (02) :341-351

[23] CTSIM: Convolution-Based Thermal Simulation using Iterative Methods [J].

Mittal, Rajat ;

Coutts, Ryan ;

Saeidi, Mehdi .

2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2016, :1347-1353

[24] Equivalent Thermal Conductivity Model Based Full Scale Numerical Simulation for Thermal Management in Fan-out Packages [J].

Wang, Ningyu ;

Jin, Yufeng ;

Pi, Yudan ;

Wang, Wei .

2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, :2054-2059

[25] Thermal and Exergy Assessment of a Micro Combustor Fueled by Premixed Hydrogen/Air under Different Sizes: a Numerical Simulation [J].

Nadimi, E. ;

Jafarmadar, S. .

JOURNAL OF APPLIED FLUID MECHANICS, 2020, 13 (04) :1233-1243

[26] Comparative analyses on FEM simulation and experiment of the hard turning using chamfered PCBN tool [J].

Chen, T. ;

Wang, Y. W. ;

Li, Y. F. ;

Yang, C. J. ;

Liu, X. L. .

E-ENGINEERING & DIGITAL ENTERPRISE TECHNOLOGY, 2008, 10-12 :303-307

[27] Nanoscale measurements of coupled mechanical, electrical and thermal properties using a novel characterization tool [J].

Singh, Utkarsha ;

Abramson, Alexis ;

Prakash, Vikas .

ELECTRONIC AND PHOTONIC PACKAGING, INTEGRATION AND PACKAGING OF MICRO/NANO/ELECTRONIC SYSTEMS, 2005, :591-598

[28] Thermal Management of Electronic Components using Makrolon Polycarbonate and Bayflex Polyurethane [J].

Davis, Terry G. ;

Rocco, Dave ;

Lorenzo, James .

2014 IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2014, :418-420

[29] On the Simulation of the Micro-Contact of Rough Surfaces Using the Example of Wet Friction Clutch Materials [J].

Voelkel, Katharina ;

Rothemund, Markus ;

Garibello, Sebastian Albarracin ;

Kramer, Vincent ;

Pflaum, Hermann ;

Stahl, Karsten .

LUBRICANTS, 2019, 7 (05)

[30] Micro-differential thermal analysis detection of adsorbed explosive molecules using microfabricated bridges [J].

Senesac, Larry R. ;

Yi, Dechang ;

Greve, Anders ;

Hales, Jan H. ;

Davis, Zachary J. ;

Nicholson, Don M. ;

Boisen, Anja ;

Thundat, Thomas .

REVIEW OF SCIENTIFIC INSTRUMENTS, 2009, 80 (03)

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