Bond zone model for a conductive crack at the interface of piezoelectric materials under anti-plane mechanical and in-plane electric loadings

被引:6
作者
Onopriienko, Oleg [1 ,2 ]
Loboda, Volodymyr [2 ]
Sheveleva, Alla [3 ]
Lapusta, Yuri [1 ]
机构
[1] Univ Clermont Auvergne, CNRS, SIGMA Clermont, F-63000 Clermont Ferrand, France
[2] Oles Honchar Dnipro Natl Univ, Dept Theoret & Computat Mech, Gagarin Ave 72, UA-49010 Dnipro, Ukraine
[3] Oles Honchar Dnipro Natl Univ, Dept Computat Math, Gagarin Ave 72, UA-49010 Dnipro, Ukraine
来源
ZAMM-ZEITSCHRIFT FUR ANGEWANDTE MATHEMATIK UND MECHANIK | 2019年 / 99卷 / 09期
关键词
anti-plane stress state; bond zone model; electrically conductive interface crack; piezoelectric material; CONTACT ZONE; PLANE; SHEAR; LAYER;
D O I
10.1002/zamm.201800230
中图分类号
O29 [应用数学];
学科分类号
070104 ;
摘要
An electrically conductive crack between two semi-infinite piezoelectric spaces under the action of anti-plane mechanical loading and in-plane electrical field parallel to the crack faces is considered. An exact analytical solution of this problem is found and the oscillating singularity is revealed at the crack tips. A new model, which is free from oscillation, is also developed for a conductive interface crack. This model is based on the introduction of a mechanically bonded zone at the conducting crack tip characterizing by zero crack faces displacement jump. The most reasonable length of this zone is found from the condition of a smooth crack closing. The validity confirmation of the bond zone model is given by means of description of conductive crack formation process. Some recommendations concerning the use of suggested model for the study of finite and infinite sized bodies with electrically conducting interface cracks are formulated.
引用
收藏
页数:13
相关论文
共 37 条
[1]   Analysis of three collinear antiplane interfacial cracks in dissimilar piezoelectric materials under non-self equilibrated electromechanical loadings on a center crack [J].
Choi, Sung Ryul ;
Chung, Ilsup .
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 2013, 27 (10) :3097-3101
[2]   Three Collinear Antiplane Interfacial Cracks in Dissimilar Piezoelectric Materials [J].
Choi, Sung Ryul ;
Shin, Jae Kyun .
INTERNATIONAL JOURNAL OF FRACTURE, 2013, 179 (1-2) :237-244
[3]   The interface crack [J].
Comninou, Maria .
Journal of Applied Mechanics, Transactions ASME, 1977, 44 (04) :631-636
[4]   AN OPPORTUNISTIC ANALYSIS OF THE INTERFACE CRACK [J].
DUNDURS, J ;
GAUTESEN, AK .
INTERNATIONAL JOURNAL OF FRACTURE, 1988, 36 (02) :151-159
[5]   A CRACK BETWEEN DISSIMILAR MEDIA [J].
ENGLAND, AH .
JOURNAL OF APPLIED MECHANICS, 1965, 32 (02) :400-&
[6]   STRESS DISTRIBUTION IN BONDED DISSIMILAR MATERIALS WITH CRACKS [J].
ERDOGAN, F .
JOURNAL OF APPLIED MECHANICS, 1965, 32 (02) :403-&
[7]   Multiple cracks on the interface between a piezoelectric layer and an orthotropic substrate [J].
Feng, Fei-Xiang ;
Lee, Kang Yong ;
Li, Yong-Dong .
ACTA MECHANICA, 2011, 221 (3-4) :297-308
[8]   Anti-plane deformation of a composite piezoceramic space with interphase crack [J].
Fil'shtinskii, LA ;
Fil'shtinskii, ML .
INTERNATIONAL APPLIED MECHANICS, 1997, 33 (08) :655-659
[9]   An analytically-numerical approach for the analysis of an interface crack with a contact zone in a piezoelectric bimaterial compound [J].
Govorukha, V. ;
Kamlah, M. .
ARCHIVE OF APPLIED MECHANICS, 2008, 78 (08) :575-586
[10]   Interface cracks in piezoelectric materials [J].
Govorukha, V. ;
Kamlah, M. ;
Loboda, V. ;
Lapusta, Y. .
SMART MATERIALS AND STRUCTURES, 2016, 25 (02)