VUV/O3 activated direct heterogeneous bonding towards high-performance LiNbO3-based optical devices

被引：18
作者：
Xu, Jikai [1 ]
Wang, Chenxi [1 ]
Zhang, Runbo [1 ]
Cheng, Ji [1 ]
Li, Ge [1 ]
Xiang, Junshan [1 ]
Tian, Yanhong [1 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Heilongjiang, Peoples R China
来源：
APPLIED SURFACE SCIENCE | 2019年 / 495卷
基金：
中国博士后科学基金; 中国国家自然科学基金;
关键词：
Direct bonding; Surface activation; Vacuum ultraviolet; Interface; LITHIUM-NIOBATE; SILICON; IRRADIATION;
D O I：
10.1016/j.apsusc.2019.143576
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
The combination of lithium niobate (LiNbO3) and glass without an intermediate layer is an essential component of micro/nanofluidics and optical waveguides. Direct bonding is a popular method for joining homo/heterogeneous materials into a single composite. However, direct bonding of LiNbO3 and glass is extremely difficult due to the chemical inertness of LiNbO3 and the large mismatch of the coefficients of thermal expansion of these materials. In this work, we realized direct bonding of LiNbO3 and glass via VUV/O-3 activation at 150 degrees C. Focused ion beam microfabrication tests and observation by scanning electron microscopy and transmission electron microscopy confirmed the strong LiNbO3/glass bonding interfaces. The excellent transmittance and piezoelectric properties of the direct bonded pairs and the single-crystal orientation of the LiNbO3 close to the glass demonstrated that the VUV/O-3 activated direct bonding method was suitable for the fabrication of high-performance surface acoustic wave (SAW)-actuated LiNbO3-based devices. Additionally, we investigated the bonding mechanism through water contact angles, atomic force microscopy, Raman spectroscopy, FTIR spectroscopy, and adhesion measurements.
引用
收藏
页数：11
相关论文
共 18 条
  • [1] VUV/O3 activated bonder for low-temperature direct bonding of Si-based materials
    Xu, Jikai
    Wang, Chenxi
    Qi, Xiaoyun
    Wu, Bin
    Zhou, Shicheng
    Tian, Yanhong
    2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 1448 - 1452
  • [2] Communication-Defect-Free Direct Bonding for High-Performance Glass-On-LiNbO3 Devices
    Xu, Jikai
    Wang, Chenxi
    Wu, Bin
    Tian, Yanhong
    Qi, Xiaoyun
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 165 (14) : B727 - B729
  • [3] Room-Temperature Bonding and Debonding of Glass and Polystyrene Substrates Based on VUV/O3 Activated Bonding Method
    Qi, Xiaoyun
    Wang, Chenxi
    Kang, Qiushi
    Li, Daoyuan
    Tian, Yanhong
    Kong, Lingchao
    2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 1453 - 1456
  • [4] Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature
    Xu, Jikai
    Wang, Chenxi
    Li, Daoyuan
    Cheng, Ji
    Wang, Yiping
    Hang, Chunjin
    Tian, Yanhong
    CERAMICS INTERNATIONAL, 2019, 45 (03) : 4094 - 4098
  • [5] Studies on low-temperature direct bonding of VUV, VUV/O3 and O2 plasma pretreated cyclo-olefin polymer
    Shinohara, Hidetoshi
    Mizuno, Jun
    Shoji, Shuichi
    SENSORS AND ACTUATORS A-PHYSICAL, 2011, 165 (01) : 124 - 131
  • [6] High Temperature Performance Over 700°C of LiNbO3-Based Ultrasonic Transducer
    Zaito, Naoki
    Kambayashi, Naoki
    Kobayashi, Makiko
    2022 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IEEE IUS), 2022,
  • [7] Direct bonding of silicon and quartz glass using VUV/O3 activation and a multistep low-temperature annealing process
    Xu, Jikai
    Wang, Chenxi
    Wang, Te
    Liu, Yannan
    Tian, Yanhong
    APPLIED SURFACE SCIENCE, 2018, 453 : 416 - 422
  • [8] Room temperature direct bonding of LiNbO3 crystal layers and its application to high-voltage optical sensing
    Tulli, D.
    Janner, D.
    Pruneri, V.
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2011, 21 (08)
  • [9] VUV/O3 assisted single crystal quartz bonding with amorphous SiO2 intermedicate layer for manufacturing optical low pass filter
    Ma, Bo
    Kuwae, Hiroyuki
    Okada, Akiko
    Fu, Weixin
    Shoji, Shuichi
    Mizuno, Jun
    2016 International Conference on Electronics Packaging (ICEP), 2016, : 447 - 450
  • [10] High-Performance Surface Acoustic Wave Devices Using LiNbO3/SiO2/SiC Multilayered Substrates
    Shen, Junyao
    Fu, Sulei
    Su, Rongxuan
    Xu, Huiping
    Lu, Zengtian
    Xu, Zhibin
    Luo, Jingting
    Zeng, Fei
    Song, Cheng
    Wang, Weibiao
    Pan, Feng
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2021, 69 (08) : 3693 - 3705
12