Reducing surface loss in 3D microwave copper cavities for superconducting transmon qubits

被引：0
作者：
Bogorin, Daniela F. [1 ]
Ware, Matthew [1 ]
McClure, D. T. [2 ,3 ]
Sorokanich, Stephen [1 ]
Plourde, B. L. T. [1 ]
机构：
[1] Syracuse Univ, Dept Phys, Syracuse, NY 13244 USA
[2] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA
[3] Syracuse, New York, NY 13244 USA
来源：
2013 IEEE 14TH INTERNATIONAL SUPERCONDUCTIVE ELECTRONICS CONFERENCE (ISEC) | 2013年
基金：
美国国家科学基金会;
关键词：
superconducting qubits; cavity quality factor; transmon; 3D cavity resonators; cQED; QUANTUM; CIRCUITS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The recent implementation of three-dimensional microwave cavities coupled to superconducting transmon qubits has led to dramatic improvements in qubit coherence times [1]. Besides the superconducting aluminum cavities that have been used in many such measurements, other recent experiments have utilized copper cavities [2] with coherence times now approaching 0.1 ms. We are investigating the effects on the quality factor for three-dimensional copper cavities that have the cavity-wall surfaces electropolished and coated with a superconducting tin layer. The copper base provides a good path for thermalizing the cavity walls and qubit chip, while the surface treatment reduces the microwave loss. We have measured a superconducting transmon qubit in such a cavity and we report our low-temperature coherence results on the same qubit and cavity measured in two different labs.
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页数：3
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