Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn-Ag-Cu solder and a Cu layer

被引：55

作者：

Shen, J. ^{[1
]}

Chan, Y. C. ^{[1
]}

机构：

[1] City Univ Hong Kong, Dept Elect Engn, Kowloon, Hong Kong, Peoples R China

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2009年 / 477卷 / 1-2期

关键词：

Lead-free solder; Flux; Nanoparticles; Wetting; LEAD-FREE SOLDERS; ALLOYS;

D O I：

10.1016/j.jallcom.2008.11.015

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Fluxes doped with nanoparticles of Ag (metal) and ZrO2 (ceramic) were found to affect the wettability characteristics of Sn-3.5Ag-0.5Cu eutectic lead-free solder on a Cu layer compared with the original flux. Wetting tests and microstructural observations showed that the Ag nanoparticles added to the flux wetted with the solder alloy and covered the molten solder surface, acting as a surface-active agent to improve the effectiveness of the flux during solder reflow. By contrast, ZrO2 nanoparticles did not wet with the solder alloy but gathered on the Cu layer to impede the molten solder from further spreading. As a result, the wettability of the Sn-3.5Ag-0.5Cu eutectic solder on a Cu layer using a flux doped with Ag nanoparticles is better than that using a flux doped with ZrO2 nanoparticles. This study has shown clearly that in order to improve the effectiveness of flux by doping with nanoparticles, the nanoparticles themselves should wet the solder alloy well. (C) 2008 Elsevier B.V. All rights reserved.

引用

页码：909 / 914

页数：6

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