Low-frequency noise assessment for deep submicrometer CMOS technology nodes

被引:31
作者
Claeys, C
Mercha, A
Simoen, E
机构
[1] IMEC, B-3001 Louvain, Belgium
[2] Katholieke Univ Leuven, Dept Elect Engn, B-3001 Louvain, Belgium
关键词
D O I
10.1149/1.1683633
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
This overview focuses on the different types of noise occurring in deep submicrometer silicon metal oxide semiconductor field- effect transistors and their use as an analytical tool. The noise sources comprise white noise, generation- recombination noise, random telegraph signal fluctuations, and 1/ f or flicker noise. The fundamental basis of each noise type is briefly described and illustrated by some practical examples. In a second part, the impact of the properties of the silicon substrate ( orientation, crystallization technique, silicon- on- insulator, SiGe) on the noise performance is discussed. Finally, the influence on the low-frequency noise behavior of different advanced process modules, such as gate stack, device isolation, silicidation, and gate engineering, is illustrated. (C) 2004 The Electrochemical Society.
引用
收藏
页码:G307 / G318
页数:12
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