Redundant Via Insertion in SADP Process with Cut Merging and Optimization

被引：0

作者：

Song, Youngsoo ^{[1
,2
]}

Jung, Jinwook ^{[2
]}

Shin, Youngsoo ^{[2
]}

机构：

[1] Samsung Elect, Hwasung 18448, South Korea

[2] Korea Adv Inst Sci & Technol, Sch Elect Engn, Daejeon 34141, South Korea

来源：

2017 IFIP/IEEE INTERNATIONAL CONFERENCE ON VERY LARGE SCALE INTEGRATION (VLSI-SOC) | 2017年

基金：

新加坡国家研究基金会;

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Line-end cuts in self-aligned double patterning (SADP) process are employed for printing 1D-gridded patterns. Redundant via (RV) requires another cut, named RV cut, to be introduced, which may cause coloring conflicts or design rule violations with adjacent line-end cuts. RV insertion should be coordinated together with cut optimization so that maximum number of RVs are inserted while incurring no coloring conflicts among cuts. A technique named cut merging is addressed to remove cut conflicts and thereby increase the number of RV candidates. Cut redistribution and color assignment (for both line-end and RV cuts) are also taken into account to further increase RV candidates.

引用

页码：141 / +

页数：6

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