Surface diffusion controlled reaction in small size microbumps

被引：10

作者：

Liu, Yingxia ^{[1
]}

Shi, Xiuyu ^{[1
]}

Ren, Haoxiang ^{[1
]}

Cai, Jian ^{[2
]}

Zhao, Xiuchen ^{[1
]}

Tan, Chengwen ^{[1
]}

Tu, K. N. ^{[3
]}

机构：

[1] Beijing Inst Technol, Sch Mat Sci & Engn, Beijing, Peoples R China

[2] Tsinghua Univ, Inst Microelect, Beijing, Peoples R China

[3] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90024 USA

来源：

MATERIALS LETTERS | 2021年 / 284卷

基金：

中国国家自然科学基金;

关键词：

Intermetallic alloys and compounds; Grain boundaries; Interfaces; Surface diffusion kinetics; Lead-free solder; 3D IC;

D O I：

10.1016/j.matlet.2020.129036

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We made head-shaped Cu-Sn solder joints with diameters about 10 mu m, 20 mu m, and 50 mu m and reflowed the samples at 240 degrees C, 260 degrees C, and 280 degrees C for 60 s to 600 s. In the 10 mu m bumps, there is only one Cu6Sn5 grain after reflow, thus the classic model of scallop-type grain growth of Cu6Sn5 does not apply. Also, the grain growth in the small size bumps has the faster growth rate. We proposed a surface diffusion controlled model to explain the new kinetics. According to our model, the diffusion activation energy is calculated to be Q(S) = 0.18 +/- 0.02 eV/atom and diffusion frequency factor to be D-S0 = 5.65 x 10(-3) cm(2)/s. (c) 2020 Elsevier B.V. All rights reserved.

引用

页数：4

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