A novel liquid imidazole-copper (II) complex as a thermal latent curing agent for epoxy resins

被引：54

作者：

Yang, Bo ^{[1
,2
]}

Mao, Yanyun ^{[2
]}

Zhang, Yihui ^{[2
]}

Bian, Guofeng ^{[2
]}

Zhang, Liying ^{[2
]}

Wei, Yi ^{[1
,2
]}

Jiang, Qiuran ^{[1
]}

Qiu, Yiping ^{[1
]}

Liu, Wanshuang ^{[1
,2
]}

机构：

[1] Donghua Univ, Key Lab Text Sci & Technol, Minist Educ, Coll Text, 2999 North Renmin Rd, Shanghai 201620, Peoples R China

[2] Donghua Univ, Collaborat Innovat Ctr Civil Aviat Composites, 2999 North Renmin Rd, Shanghai 201620, Peoples R China

来源：

POLYMER | 2019年 / 178卷

基金：

上海市自然科学基金;

关键词：

Epoxy resins; Imidazole-copper (II) complex; Latent curing agent; METAL-ORGANIC FRAMEWORKS; MATRIX-ISOLATION; CROSS-LINKING; DERIVATIVES; TOPOLOGY; CURE;

D O I：

10.1016/j.polymer.2019.121586

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

In this study, 1-cyanoethyl-2-ethyl-4-methylimidazole (1C2E4MI) was modified by copper chloride to improve its thermal latency towards epoxy resins. Unexpected complexation between 1C2E4MI and copper chloride was discovered, and two complexes which included a liquid and a solid were generated. The microanalytical results show that the ligand-metal ratios of these two complexes are 7:1 (liquid) and 1:1 (solid), rather than the theoretical 4:1 ratio. The liquid 1C2E4MI-copper (II) complex (Complex-L) exhibits superior miscibility with epoxy resins, and the resulting epoxy systems show distinctly prolonged pot life at 25 and 60 degrees C. Curing kinetic study indicates the epoxy system containing Complex-L can be cured using a similar manner like that containing 1C2E4MI. Moreover, the epoxy resin cured with Complex-L has glass transition temperature and tensile properties comparable to that cured with 1C2E4MI.

引用

页数：8

共 35 条

[1] Dual function photocatalysis of cyano-bridged heteronuclear metal complexes for water oxidation and two-electron reduction of dioxygen to produce hydrogen peroxide as a solar fuel [J].