On the mechanism that leads to vanishing thermal hysteresis of the B2-R phase transformation in multilayered (TiNi)/(W) shape memory alloy thin films

被引:7
作者
Buenconsejo, Pio John S. [1 ]
Zarnetta, Robert [1 ]
Young, Marcus [1 ]
Brunken, Hayo [1 ]
Mehta, Apurva [2 ]
Ludwig, Alfred [1 ]
机构
[1] Ruhr Univ Bochum, Inst Math, D-44780 Bochum, Germany
[2] Stanford Synchrotron Radiat Lightsource SLAC MSD, Menlo Pk, CA USA
关键词
synchrotron diffraction; Ti-Ni-W; thin films; shape memory alloys; thermal hysteresis; NI SINGLE-CRYSTALS; STRESS EVOLUTION; TINI FILM; CU; RELAXATION; TRANSITION; CONSTRAINT; RECOVERY; PD;
D O I
10.1016/j.tsf.2014.05.010
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The film stresses in two-phase (TiNi)/(W) shape memory alloy (SMA) multilayer thin films were evaluated using synchrotron diffraction analysis. The phase transforming B2-TiNi phase is under tensile stress due to the mismatch of the coefficient-of-thermal-expansion (alpha(B2-TiNi) > alpha(W)> alpha(Si-substrate)) and the elastic modulus (E-W > E-Si > EB2-TiNi) with respect to the bcc-W layers and the Si-substrate. The amount of stress on the B2-TiNi phase increases with increasing W amount in the film, which is proportional to the W layer thickness. This led to important changes in the behavior of the B2-R transformation. On cooling, a B2-R transformation proceeds under increasing tensile stress which increases the transformation start temperature (R-s). Upon transformation to the R phase, the TiNi layers undergo stress-relaxation by reorientation of R phase variants to accommodate the mismatch. During heating the film always starts from a relaxed stress-state, so the reverse transformation proceeds without adversely affecting the reverse transformation temperature (A(f)). With increasing amount of W in the film R-s increases more on cooling, while A(f) is not significantly affected on heating, and this leads to vanishing thermal hysteresis (Delta TB2-R = A(f) - R-s). (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:79 / 85
页数:7
相关论文
共 23 条
[1]  
[Anonymous], 2009, Thin film shape memory alloys fundamentals and device applications
[2]   The effects of grain size on the phase transformation properties of annealed (Ti/Ni/W) shape memory alloy multilayers [J].
Buenconsejo, Pio John S. ;
Zarnetta, Robert ;
Ludwig, Alfred .
SCRIPTA MATERIALIA, 2011, 64 (11) :1047-1050
[3]   A New Prototype Two-Phase (TiNi)-(β-W) SMA System with Tailorable Thermal Hysteresis [J].
Buenconsejo, Pio John S. ;
Zarnetta, Robert ;
Koenig, Dennis ;
Savan, Alan ;
Thienhaus, Sigurd ;
Ludwig, Alfred .
ADVANCED FUNCTIONAL MATERIALS, 2011, 21 (01) :113-118
[4]  
Cardarelli F., 2008, MAT HDB CONCISE DESK
[5]   Constrained martensitic transformations in TiNiCu films [J].
Craciunescu, CM ;
Li, J ;
Wuttig, M .
THIN SOLID FILMS, 2003, 434 (1-2) :271-275
[6]   Deposition and characterization of Ti1-x(Ni,Cu)x shape memory alloy thin films [J].
Du, HJ ;
Fu, YQ .
SURFACE & COATINGS TECHNOLOGY, 2004, 176 (02) :182-187
[7]   Characterization of TiNi shape-memory alloy thin films for MEMS applications [J].
Fu, YQ ;
Huang, WM ;
Du, HJ ;
Huang, X ;
Tan, JP ;
Gao, XY .
SURFACE & COATINGS TECHNOLOGY, 2001, 145 (1-3) :107-112
[8]   Effects of film composition and annealing on residual stress evolution for shape memory TiNi film [J].
Fu, YQ ;
Du, HJ .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2003, 342 (1-2) :236-244
[9]   Relaxation and recovery of stress during martensite transformation for sputtered shape memory TiNi film [J].
Fu, YQ ;
Du, HJ .
SURFACE & COATINGS TECHNOLOGY, 2002, 153 (01) :100-105
[10]   Relaxation and recovery of extrinsic stress in sputtered titanium-nickel thin films on (100)-Si [J].
Grummon, DS ;
Zhang, JP ;
Pence, TJ .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1999, 273 :722-726