Flip-chip packaging configuration with Coplanar strip lines for millimeter electromagnetic waves

被引：2

作者：

Song, Young K. ^{[1
]}

Lee, Chin C. ^{[1
]}

机构：

[1] Univ Calif Irvine, Mat Sci &Engn, Elect Engn & Comp Sci, Irvine, CA 92697 USA

来源：

56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS | 2006年

关键词：

D O I：

10.1109/ECTC.2006.1645887

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Flip-chip configuration based on Coplanar strip (CPS) lines is reported for millimeter-wave device applications. We designed and implemented the flip-chip configuration using a test chip directly on dielectric boards with CPS lines for wideband interconnections. The chip is connected to the board using solder balls. The flip-chip assembles are evaluated up to 40GHz by S-parameters. Insertion loss, 10LOG vertical bar 1/S-21 vertical bar(2), as low as 3dB is achieved at 30GHz. The corresponding return loss, 10LOG vertical bar 1/S-11 vertical bar(2) is 15dB. We also analyzed the attenuation coefficient of CPS based on geometrical configuration to achieve optimum design on PCBs. For CPS lines built on RT/Duroid, the measured attenuation coefficient is as low as 1.1dB/cm at 40GHz. Attenuation analysis was performed by employing numerical full wave calculation with HFSS tool.

引用

页码：1700 / +

页数：2

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