Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding

被引：138

作者：

Blanco, FJ ^{[1
]}

Agirregabiria, M ^{[1
]}

Garcia, J ^{[1
]}

Berganzo, J ^{[1
]}

Tijero, M ^{[1
]}

Arroyo, MT ^{[1
]}

Ruano, JM ^{[1
]}

Aramburu, I ^{[1
]}

Mayora, K ^{[1
]}

机构：

[1] Ikerlan S Coop, MEMS, MST Dept, Arrasate Mondragon 20500, Gipuzkoa, Spain

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2004年 / 14卷 / 07期

关键词：

D O I：

10.1088/0960-1317/14/7/027

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes a novel fabrication method for the manufacture of three-dimensional (3D) interconnected microchannels. The fabrication is based on a full wafer polymer bonding process, using SU-8 polymer epoxy photoresist as a structural material. The technology development includes an improvement of the SU-8 photolithography process in order to produce high uniformity films with good adhesive properties. Hence, 3D embedded microchannels are fabricated by a low temperature adhesive bonding of the SU-8 photopatterned thick films. The bonding occurs at temperatures (100-120 degreesC) lower than those usually applied in bonding technology. The bonding process parameters have been chosen in order to achieve a strong and void-free bond. High bond strengths, up to 8 MPa, have been obtained. Several examples using this new technology are shown, including bonding between different combinations of silicon and Pyrex wafers. This method also allows us to bond wafers with previously surface micromachined structures. Interconnected microchannels with vertical smooth walls and aspect ratios up to five have been obtained. Channels from 40 to 60 mum depth and from 10 to 250 mum width have been achieved. Liquid has been introduced at different levels into the microchannels, verifying good sealing of the 3D interconnected microchannels. The fabrication procedure described in this paper is fast, reproducible, CMOS compatible and easily implementable using standard photolithography and bonding equipment.

引用

页码：1047 / 1056

页数：10

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