Comparative characterization of Cu-Ni substrates for coated conductors

被引:18
作者
Tian, H. [1 ]
Suo, H. L. [1 ]
Wulff, A. C. [2 ]
Grivel, J. -C. [2 ]
Mishin, O. V. [3 ]
Jensen, D. Juul [3 ]
机构
[1] Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
[2] Tech Univ Denmark, Dept Energy Convers & Storage, DK-4000 Roskilde, Denmark
[3] Tech Univ Denmark, Dept Wind Energy, Sect Mat Sci & Adv Characterizat, Danish Chinese Ctr Nanomet, DK-4000 Roskilde, Denmark
基金
中国国家自然科学基金; 新加坡国家研究基金会;
关键词
Cu-Ni alloys; RABiTS Cube texture; EBSD; GRAIN-BOUNDARY ENSEMBLES; RECRYSTALLIZATION; MICROSTRUCTURE; EVOLUTION; RECOVERY; TEXTURE; ALLOYS; GROWTH; NICKEL; TAPES;
D O I
10.1016/j.jallcom.2014.02.114
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Three Cu100-xNix alloys, with x = 23, 33 and 45 at.% Ni, have been evaluated for use as substrates for coated conductors on the basis of measurements of their microstructure, crystallographic texture and hardness. It is found that high-temperature annealing after heavy rolling generates strong cube textures in each investigated alloy. For all of these alloys an increase in the annealing temperature from 800 to 1000 degrees C strengthens the cube texture and reduces the fraction of high angle grain boundaries. In the Cu-23 at.% Ni and Cu-33 at.% Ni alloys annealed at 1000 degrees C for 1 h, the fraction of the cube texture approaches 100% and the fraction of high angle boundaries is less than 4%. These two alloys are however very soft in the annealed condition. The cube texture in the Cu-45 at.% Ni substrate is slightly weaker than in the two other alloys, but this substrate is considerably harder, which makes it better suited for large scale production of superconducting tapes. (C) 2014 Elsevier B. V. All rights reserved.
引用
收藏
页码:9 / 13
页数:5
相关论文
共 25 条
  • [1] Importance of low-angle grain boundaries in YBa2Cu3O7-δ coated conductors
    Durrell, J. H.
    Rutter, N. A.
    [J]. SUPERCONDUCTOR SCIENCE & TECHNOLOGY, 2009, 22 (01)
  • [2] Textured Ni-9.0 at.% W substrate tapes for YBCO-coated conductors
    Eickemeyer, J.
    Huehne, R.
    Gueth, A.
    Rodig, C.
    Gaitzsch, U.
    Freudenberger, J.
    Schultz, L.
    Holzapfel, B.
    [J]. SUPERCONDUCTOR SCIENCE & TECHNOLOGY, 2010, 23 (08)
  • [3] Highly alloyed Ni-W substrates for low AC loss applications
    Gaitzsch, Uwe
    Haenisch, Jens
    Huehne, Ruben
    Rodig, Christian
    Freudenberger, Jens
    Holzapfel, Bernhard
    Schultz, Ludwig
    [J]. SUPERCONDUCTOR SCIENCE & TECHNOLOGY, 2013, 26 (08)
  • [4] Paramagnetic substrates for thin film superconductors: Ni-W and Ni-W-Cr
    Gaitzsch, Uwe
    Eickemeyer, Joerg
    Rodig, Christian
    Freudenberger, Jens
    Holzapfel, Bernhard
    Schultz, Ludwig
    [J]. SCRIPTA MATERIALIA, 2010, 62 (07) : 512 - 515
  • [5] Fabrication of the Textured Ni-9.3at.% W Alloy Substrate for Coated Conductors
    Gao, M. M.
    Suo, H. L.
    Grivel, J. -C.
    Zhao, Y.
    Gao, P. K.
    Liu, M.
    Ma, L.
    [J]. IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2011, 21 (03) : 2969 - 2972
  • [6] Industrial Cu-Ni alloys for HTS coated conductor tape.
    Girard, A.
    Bruzek, C. E.
    Jorda, J. L.
    Ortega, L.
    Soubeyroux, J. L.
    [J]. 7TH EUROPEAN CONFERENCE ON APPLIED SUPERCONDUCTIVITY (EUCAS'05), 2006, 43 : 341 - 344
  • [7] The RABiTS approach: Using rolling-assisted biaxially textured substrates for high-performance YBCO superconductors
    Goyal, A
    Paranthaman, MP
    Schoop, U
    [J]. MRS BULLETIN, 2004, 29 (08) : 552 - 561
  • [8] High critical current density superconducting tapes by epitaxial deposition of YBa2Cu3Ox thick films on biaxially textured metals
    Goyal, A
    Norton, DP
    Budai, JD
    Paranthaman, M
    Specht, ED
    Kroeger, DM
    Christen, DK
    He, Q
    Saffian, B
    List, FA
    Lee, DF
    Martin, PM
    Klabunde, CE
    Hartfield, E
    Sikka, VK
    [J]. APPLIED PHYSICS LETTERS, 1996, 69 (12) : 1795 - 1797
  • [9] Microstructure and strength of nickel at large strains
    Hughes, DA
    Hansen, N
    [J]. ACTA MATERIALIA, 2000, 48 (11) : 2985 - 3004
  • [10] HUGHES DA, 1993, METALL TRANS A, V24, P2021