Inkjet-/3D-/4D-Printed Perpetual Electronics and Modules

被引:25
作者
Eid, Aline [1 ]
He, Xuanke [1 ]
Bahr, Ryan [1 ]
Lin, Tong-Hong [1 ]
Cui, Yepu [1 ]
Adeyeye, Ajibayo [1 ]
Tehrani, Bijan [1 ]
Tentzeris, Manos M. [1 ]
机构
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
基金
美国国家科学基金会;
关键词
WIRELESS; TECHNOLOGIES; RECTENNA; SYSTEM;
D O I
10.1109/MMM.2020.3023310
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
With the revolutionary developments in the fields of millimeter-wave (mm-wave) and Internet of Things (IoT) technologies and the billion devices promised to be implemented by the end of the decade, the realization of inexpensive, low-power, and intelligent systems is highly desirable. Additive manufacturing (AM) is a technology seeing widespread adoption due to its ability to enable rapid prototyping for iterative design; its reduced setup costs, facilitating economic small-batch production; and its ability to significantly reduce waste by-products, resulting in both environmental benefits as well as lower manufacturing costs. On the other hand, current lithography-based manufacturing technologies-a huge contributor to the growing RF and 5G wireless electronics industry-require extensive design verification, have longer turnaround times, and produce harmful byproducts. Although AM can offer time and cost benefits under the correct conditions, among the more impactful demonstrations of the manufacturing technology are the novel topologies enabled by design rules that allow feature sets, including nonorthogonal planes, conformal surfaces, multimaterial deposition, simultaneous thick- and thin-film deposition [1], complex 3D structures, integrated voids, and gradient index materials. © 2000-2012 IEEE.
引用
收藏
页码:87 / 103
页数:17
相关论文
共 51 条
[1]  
Adeyeye AO, 2019, EUR MICROW CONF, P105, DOI [10.23919/eumc.2019.8910740, 10.23919/EuMC.2019.8910740]
[2]  
Armiento Craig, 2017, 2017 International Conference on Electronics Packaging (ICEP). Proceedings, P1, DOI 10.23919/ICEP.2017.7939309
[3]  
Bito Jo, 2017, IEEE WIRELESS POWER
[4]   A Chip-First Approach to Millimeter-Wave Circuit Packaging [J].
Craton, Michael Thomas ;
Albrecht, John D. ;
Chahal, Premjeet ;
Papapolymerou, John .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2019, 29 (02) :116-118
[5]  
Cui Y., P 2019 INT APPL COMP, P1
[6]  
Cui Y, 2020, HIV/AIDS IN CHINA: EPIDEMIOLOGY, PREVENTION AND TREATMENT, P3, DOI 10.1007/978-981-13-8518-6_1
[7]   Novel 3D-Printed Reconfigurable Origami Frequency Selective Surfaces With Flexible Inkjet-Printed Conductor Traces [J].
Cui, Yepu ;
Nauroze, Syed Abdullah ;
Tentzeris, Manos M. .
2019 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2019, :1367-1370
[8]  
Eid A, 2019, IEEE ANTENNAS PROP, P1163, DOI [10.1109/apusncursinrsm.2019.8888600, 10.1109/APUSNCURSINRSM.2019.8888600]
[9]  
Eid Aline, 2019, 2019 IEEE MTT-S International Microwave Symposium (IMS), P1309
[10]  
Eid A., P 2020 IEEE INT S AN