Silicon-nanoforest-based solvent-free micro-supercapacitors with ultrahigh spatial resolution via IC-compatible in situ fabrication for on-chip energy storage

被引:13
|
作者
Chi, Cheng [1 ,3 ]
Li, Dezhao [2 ]
Li, Yang [3 ]
Qi, Xin [1 ]
Huang, He [3 ]
Wang, Qi [3 ]
Lin, Chongjia [3 ]
Zhang, Xing [1 ]
Ma, Weigang [1 ]
Huang, Baoling [3 ,4 ]
机构
[1] Tsinghua Univ, Dept Engn Mech, Key Lab Thermal Sci & Power Engn, Minist Educ, Beijing 100084, Peoples R China
[2] Zhejiang Univ Technol, Coll Sci, Key Lab Quantum Precis Measurement Zhejiang Prov, Hangzhou 310023, Peoples R China
[3] Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Clear Water Bay, Hong Kong, Peoples R China
[4] Hong Kong Univ Sci & Technol, HKUST Foshan Res Inst Smart Mfg, Clear Water Bay, Hong Kong, Peoples R China
关键词
SOLID-STATE MICROSUPERCAPACITORS; HIGH-PERFORMANCE; TITANIUM NITRIDE; NANOROD ARRAY; GRAPHENE; NANOWIRES; ELECTRODE; DESIGN; FILMS;
D O I
10.1039/d0ta07540j
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Micro-supercapacitors (MSCs) provide a promising on-chip solution for powering future microdevices. However, their practical applications have been seriously hindered by IC-incompatible manufacturing processes and dimensional limitations. Here, interdigital MSCs with in situ fabricated 3D polysilicon/nickel nanoforest (SNNF) electrodes were developed through a scalable IC-compatible process. The produced MSCs exhibit an exceptionally small footprint area and an ultra-high spatial resolution that is one order of magnitude higher than those obtained by ex situ methods. With a new solid polymer electrolyte (PVDF-HFP)/LiBOB/TiO2, the all-solid-state MSCs demonstrated a superior device areal capacitance up to 0.53 mF cm(-2) (electrode areal capacitance: 5.47 mF cm(-2)), high volumetric power density of 4.15 W cm(-3) with an energy density of 0.15 mW h cm(-3), excellent cycling stability (>90% capacitance retention after 10 000 cycles) and fast frequency response (relaxation time: 1.09 ms), showing great potential as a high-performance and reliable on-chip power source for miniaturized devices.
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页码:22736 / 22744
页数:9
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