Thermal resistance and pressure drop of silicon based micro pin fin heat exchanger under cross flow

被引：2

作者：

Prasher, Ravi S. ^{[1
]}

Dirner, John ^{[1
]}

Chang, Je-Young ^{[1
]}

Myers, Alan ^{[1
]}

Chau, David ^{[1
]}

He, Dongming ^{[1
]}

Prstic, Suzana ^{[1
]}

机构：

[1] Intel Corp, Chandler, AZ 85226 USA

来源：

ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C | 2005年

关键词：

D O I：

10.1115/IPACK2005-73086

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We have performed a parametric study of the thermal and hydraulic performance of silicon-based micro pin fin heat exchangers with water as the fluid. Circular and square micro pin fins have been fabricated. The pin dimensions ranged from 50 mu m to 150 mu m. The test chip is unique because it has 20 micro temperature sensors of the size 75 mu m X 75 mu m to accurately capture the thermal resistance of the micro pin fin heat exchanger. Data shows that there is no difference in the hydraulic and the thermal resistance of circular and square pins. Conventional correlations for friction factor and Nusselt number match well with the data.

引用

页码：717 / 725

页数：9

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