An optimized model of skin effect for on-chip spiral inductors

被引：5
|
作者：
Sun, X [1 ]
Carchon, G [1 ]
De Raedt, W [1 ]
机构：
[1] IMEC, Microwave & RF Syst Grp, B-3001 Louvain, Belgium
来源：
2004 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS | 2004年
关键词：
lumped-element model; on-chip spiral inductor; skin effect network; mutual inductance; wafer level packaging;
D O I：
10.1109/RFIC.2004.1320649
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An accurate equivalent network for modeling the skin effect is presented. Rules for choosing the number of parallel R-L branches for precisely modeling the skin effect in spiral inductors are presented. The concept has been verified using high-Q on-chip inductors realized using wafer level packaging techniques. A good agreement between measurements and simulations has been obtained up to the first resonance.
引用
收藏
页码：445 / 448
页数：4
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