Experimental evaluation of the probe test for measuring thin film adhesion

被引：0

作者：

Dillard, DA ^{[1
]}

Scott, C ^{[1
]}

Mount, K ^{[1
]}

Xu, DY ^{[1
]}

Wan, KT ^{[1
]}

West, R ^{[1
]}

Dillard, JG ^{[1
]}

机构：

[1] Virginia Tech, Ctr Adhes & Sealant Sci, Blacksburg, VA 24061 USA

来源：

ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003 | 2003年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A probe test is proposed to quantify the adhesion of thin films and coatings. Using a micromanipulator, a tungsten probe is advanced into the edge of a polymeric coating. Debonds initiate at the loading point and propagate into semicircular cracks at the interface as the probe slides under the coating. The size of the debond is related to the interfacial fracture energy; poorer adhesion results in larger debonds for a given probe displacement. Approximate. closed-form and finite element analyses of the geometry have been conducted, along with a significant number of experiments on as-produced and environmentally-conditioned specimens. The technique is showing considerable promise for characterizing coating adhesion, and has certain advantages over existing techniques for certain applications.

引用

页码：51 / 56

页数：6