Edge termination design and simulation for bulk GaN rectifiers

被引:15
作者
Baik, KH [1 ]
Irokawa, Y
Ren, F
Pearton, SJ
Park, SS
Lee, SK
机构
[1] Univ Florida, Dept Mat Sci & Engn, Gainesville, FL 32611 USA
[2] Toyota Cent Res & Dev Labs Inc, Nagakute, Aichi 4801192, Japan
[3] Univ Florida, Dept Chem Engn, Gainesville, FL 32611 USA
[4] Samsung Adv Inst Technol, Suwon 440600, South Korea
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2002年 / 20卷 / 05期
关键词
D O I
10.1116/1.1511210
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
GaN bulk rectifiers show excellent on-state resistances (in the mOmega cm-2 range), forward turn-on voltages of similar to 1. 8 V and reverse-recovery times of <50 ns. A key requirement is to develop effective edge termination techniques in order to prevent premature surface-induced breakdown. We have performed a simulation study of the effects of varying the dielectric passivation material (SiO2, SiN, AIN, SC2O3, or MgO), the thickness of this material, the extent of metal overlap onto the dielectric and the ramp oxide angle on the resulting reverse breakdown voltage (V-B) of bulk rectifiers. We find that SiO2 produces the highest. V-B of the materials investigated, that there is an optimum metal overlap distance for a given oxide thickness and small oxide ramp angles produce the highest V-B. (C) 2002 American Vacuum Society.
引用
收藏
页码:2169 / 2172
页数:4
相关论文
共 29 条
[1]   High voltage (450 V) GaN schottky rectifiers [J].
Bandic, ZZ ;
Bridger, PM ;
Piquette, EC ;
McGill, TC ;
Vaudo, RP ;
Phanse, VM ;
Redwing, JM .
APPLIED PHYSICS LETTERS, 1999, 74 (09) :1266-1268
[2]   Medici simulation of 6H-SiC oxide ramp profile Schottky structure [J].
Brezeanu, G ;
Fernandez, J ;
Millan, J ;
Badila, M ;
Dilimot, G .
SILICON CARBIDE, III-NITRIDES AND RELATED MATERIALS, PTS 1 AND 2, 1998, 264-2 :941-944
[3]   Megawatt solid-state electronics [J].
Brown, ER .
SOLID-STATE ELECTRONICS, 1998, 42 (12) :2119-2130
[4]   Steady-state and transient forward current-voltage characteristics of 4H-silicon carbide 5.5 kV diodes at high and superhigh current densities [J].
Dyakonova, NV ;
Ivanov, PA ;
Kozlov, VA ;
Levinshtein, ME ;
Palmour, JW ;
Rumyantsev, SL ;
Singh, R .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1999, 46 (11) :2188-2194
[5]  
Gila BP, 2001, PHYS STATUS SOLIDI A, V188, P239, DOI 10.1002/1521-396X(200111)188:1<239::AID-PSSA239>3.0.CO
[6]  
2-D
[7]  
Heydt GT, 1998, MATER RES SOC SYMP P, V483, P3
[8]  
HONG M, 2000, 197 EL SOC M TOR CAN, P278
[9]   Excellent reverse blocking characteristics of high-voltage 4H-SiC Schottky rectifiers with boron-implanted edge termination [J].
Itoh, A ;
Kimoto, T ;
Matsunami, H .
IEEE ELECTRON DEVICE LETTERS, 1996, 17 (03) :139-141
[10]   Breakdown voltage and reverse recovery characteristics of free-standing GaN Schottky rectifiers [J].
Johnson, JW ;
Zhang, AP ;
Luo, WB ;
Ren, F ;
Pearton, SJ ;
Park, SS ;
Park, YJ ;
Chyi, JI .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2002, 49 (01) :32-36