Chip-based silica microspheres for cavity optomechanics

被引：43

作者：

Jiang, Xuefeng ^{[1
,2
]}

Wang, Min ^{[1
,2
,3
,4
]}

Kuzyk, Mark C. ^{[1
,2
]}

Oo, Thein ^{[1
,2
]}

Long, Gui-Lu ^{[3
,4
]}

Wang, Hailin ^{[1
,2
]}

机构：

[1] Univ Oregon, Dept Phys, Eugene, OR 97403 USA

[2] Univ Oregon, Oregon Ctr Opt, Eugene, OR 97403 USA

[3] Tsinghua Univ, State Key Lab Low Dimens Quantum Phys, Beijing 100084, Peoples R China

[4] Tsinghua Univ, Dept Phys, Beijing 100084, Peoples R China

来源：

OPTICS EXPRESS | 2015年 / 23卷 / 21期

基金：

美国国家科学基金会;

关键词：

ON-CHIP; MICROCAVITIES; MODE;

D O I：

10.1364/OE.23.027260

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

We have experimentally realized on-chip silica microspheres that feature excellent thermal coupling to the silicon wafer. The chip-based microspheres significantly reduce laser-induced heating and correspondingly exhibit much lower threshold optical power for heating-induced optical bistability. We also show that the chip-based microspheres have optical and especially optomechanical properties that are similar to those of traditional fiber-stem-attached silica microspheres, making the chip-based microspheres suitable for optomechanical studies in a vacuum environment. (C) 2015 Optical Society of America

引用

页码：27260 / 27265

页数：6

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