Micro-welding using laser-generated ultrasound

被引：0

作者：

Dou, Guangbin ^{[1
]}

Gower, Malcolm C. ^{[1
]}

Holmes, Andrew S. ^{[1
]}

机构：

[1] Imperial Coll London, Dept Elect & Elect Engn, London SW7 2AZ, England

来源：

2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC) | 2016年

基金：

英国工程与自然科学研究理事会;

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We demonstrate a novel micro-welding process in which laser-generated stress waves produced close to the bonding site assist in the formation of direct metal-metal bonds. The process has been used to attach copper bumped silicon flip-chips to silver-metallized substrates. De-bonding tests were used to study qualitatively the resulting chip-substrate bonds. It was found that generally the copper-silver welding strength exceeded the adhesion strength between bump and chip. Individual bump shear tests were carried out after de-bonding and showed shear strengths of similar to 116 MPa. In addition, scanning-electron microscope (SEM) and focused-ion-beam-scanning electron-microscope (FIB-SEM) imaging were used to analyse the test samples, revealing that the welding was direct copper-silver solid-state diffusion welding. This new process allows direct metal-metal bonding at low temperature and with localized control over the bonding parameters. Applications are envisaged in advanced electronics packaging where low process temperature or high operational reliability are required.

引用

页数：4

共 10 条

[1]

COUCOULAS A, 1966, T METALL SOC AIME, V236, P587

[2]

Dou G., 2012, P 4 SYST INT TECHN C, P1

[3] Effects of the shock duration on the response of CFRP composite laminates [J].

Gay, Elise ;

Berthe, Laurent ;

Boustie, Michel ;

Arrigoni, Michel ;

Buzaud, Eric .

JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2014, 47 (45)

[4] The law of ultrasonic energy conversion in thermosonic flip chip bonding interfaces [J].

Li Junhui ;

Wang Ruishan ;

He Hu ;

Wang Fuliang ;

Han Lei ;

Zhong Jue .

MICROELECTRONIC ENGINEERING, 2009, 86 (10) :2063-2066

[5]

Liu J., 1999, CONDUCTIVE ADHESIVES

[6] CONTROLLED COLLAPSE REFLOW CHIP JOINING [J].

MILLER, LF .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (03) :239-&

[7] Experimental assessment of the influence of irradiation parameters on surface deformation and residual stresses in laser shock processed metallic alloys [J].

Ocaña, JL ;

Molpeceres, C ;

Porro, JA ;

Gómez, G ;

Morales, M .

APPLIED SURFACE SCIENCE, 2004, 238 (1-4) :501-505

[8] The drive to miniaturization [J].

Peercy, PS .

NATURE, 2000, 406 (6799) :1023-1026

[9]

Prymark J., 2001, FUNDAMENTALS MICROSY

[10] Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface [J].

Wang, Fuliang ;

Chen, Yun ;

Han, Lei .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (06) :852-858

← 1 →